GB/T 16649.2-2024 识别卡 集成电路卡 第2部分：带触点的卡 触点的尺寸和位置
GB/T 16649.2-2024 Identification cards—Integrated circuit cards—Part 2:Cards with contacts—Dimensions and location of the contacts
基本信息
本文件适用于带触点集成电路卡的设计、生产、使用和检验。
本文件与GB/T 16649.1一起使用。
发布历史
-
1996年12月
-
2006年03月
-
2024年08月
研制信息
- 起草单位：
- 中国电子技术标准化研究院、北京智芯微电子科技有限公司、江苏赛西科技发展有限公司、深圳赛西信息技术有限公司、中电智能卡有限责任公司、北京安御道合科技有限公司、金邦达有限公司、中移动金融科技有限公司、东信和平科技股份有限公司、武汉天喻信息产业股份有限公司、飞天诚信科技股份有限公司、北京握奇数据股份有限公司、新大陆数字技术股份有限公司、北京中电华大电子设计有限责任公司、深圳市茂业鑫精密科技有限公司、北京华弘集成电路设计有限责任公司、楚天龙股份有限公司、上海密特印制有限公司、中国银联股份有限公司、上海复旦微电子集团股份有限公司、大唐微电子技术有限公司
- 起草人：
- 曹国顺、王祥、张刚、徐平江、白婧、徐木平、董扬、楼水勇、高健、苏昆、朱鹏飞、赵轶、蔡春水、潘亮、钟武强、韩博、曹海涛、夏立佳、杨凯宇、张晓良、束敏、黄海明、徐文军
- 出版信息：
- 页数：13页 | 字数：21 千字 | 开本： 大16开
内容描述
ICS35.240.15
CCSL64
中华人民共和国国家标准
GB/T16649.2—2024
代替GB/T16649.2—2006
识别卡集成电路卡
第2部分：带触点的卡
触点的尺寸和位置
Identificationcards—Integratedcircuitcards—Part2：Cardswithcontacts—
Dimensionsandlocationofthecontacts
（ISO/IEC7816⁃2：2007，MOD）
2024⁃08⁃23发布2025⁃03⁃01实施
国家市场监督管理总局
国家标准化管理委员会发布
GB/T16649.2—2024
目次
前言··························································································································Ⅲ
引言··························································································································Ⅴ
1范围·······················································································································1
2规范性引用文件········································································································1
3术语和定义··············································································································1
4触点的尺寸··············································································································1
5触点的数量和位置·····································································································2
6相关其他技术的触点位置····························································································4
附录A（资料性）触点的使用··························································································6
附录B（资料性）可能的导电区的位置··············································································7
参考文献·····················································································································8
图1触点的最小尺寸····································································································2
图2卡的正面·············································································································2
图3ID⁃1触点的位置···································································································3
图42FF触点的位置····································································································3
图53FF触点的位置····································································································4
图64FF触点的位置····································································································4
图7卡的正面·············································································································5
图8卡的背面·············································································································5
图B.1可能的导电区的位置···························································································7
图B.2可能的导电区触点的位置·····················································································7
表A.1GB/T16649系列标准相应触点的分配····································································6
Ⅰ
GB/T16649.2—2024
前言
本文件按照GB/T1.1—2020《标准化工作导则第1部分：标准化文件的结构和起草规则》的规
定起草。
本文件是GB/T16649的第2部分。GB/T16649已经发布了以下部分：
——识别卡带触点的集成电路卡第1部分：物理特性；
——识别卡集成电路卡第2部分：带触点的卡触点的尺寸和位置；
——识别卡集成电路卡第3部分：带触点的卡电接口和传输协议；
——识别卡集成电路卡第4部分：用于交换的结构、安全和命令；
——识别卡带触点的集成电路卡第5部分：应用标识符的国家编号体系和注册规程；
——识别卡带触点的集成电路卡第6部分：行业间数据元；
——识别卡带触点的集成电路卡第7部分：用于结构化卡查询语言（SCQL）的行业间命令；
——识别卡带触点的集成电路卡第8部分：与安全相关的行业间命令；
——识别卡集成电路卡第9部分：用于卡管理的命令；
——识别卡带触点的集成电路卡
定制服务
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