GB/T 29846-2025 印制板用光成像耐电镀抗蚀剂

ICS

31.030

CCS

L90

中华人民共和国国家标准

GB/T29846—2025

代替GB/T29846—2013

印制板用光成像耐电镀抗蚀剂

Photoimageableplatingandetchingresistforprintedcircuitboard

2025-08-01发布2026-02-01实施

国家市场监督管理总局发布

国家标准化管理委员会

GB/T29846—2025

目次

前言

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Ⅲ

1

范围

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2

规范性引用文件

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1

3

术语和定义

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1

4

要求

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2

4.1

成像前

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2

4.2

成像后

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3

5

试验方法

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4

5.1

试样

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4

5.2

外观和尺寸

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6

5.3

液态耐电镀抗蚀剂的粘度

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6

5.4

液态耐电镀抗蚀剂的细度

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7

5.5

最小线宽和线间距

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7

5.6

耐电镀性和耐化学镀性

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7

5.7

抗蚀刻性

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7

5.8

封孔性

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7

5.9

色差

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7

5.10

显影时间

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7

5.11

退膜时间

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7

5.12

填充能力

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6

检验规则

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6.1

检验条件

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6.2

检验分类

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6.3

型式检验

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6.4

出厂检验

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7

标志、包装、运输和贮存

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9

7.1

标志

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7.2

包装

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7.3

运输

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7.4

贮存

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10

参考文献

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11

Ⅰ

GB/T29846—2025

前言

本文件按照GB/T1.1—2020《标准化工作导则第1部分：标准化文件的结构和起草规则》的规

定起草。

本文件代替GB/T29846—2013《印制板用光成像耐电镀抗蚀剂》，与GB/T29846—2013相比，

除结构调整和编辑性改动外，主要技术变化如下：

a）范围中删除了光成像抗电镀剂，增加了光成像耐化学镀抗蚀剂（见第1章，2013年版的第1章）；

b）增加了耐电镀抗蚀剂、耐化学镀性、干膜光致抗蚀剂、液态光致抗蚀剂、高密度互连印制板、

封装基板的术语和定义（见3.1、3.5~3.9），删除了辊涂、无图形网印、浸涂、曝光能量、曝

光级数和后固化的术语和定义（见2013年版的3.1~3.3、3.5~3.7）；

c）更改了液态耐电镀抗蚀剂成像前的粘度要求，增加了预干燥后的厚度要求（见4.1.1，2013年版

的4.1）；

d）增加了干膜光致抗蚀剂成像前的性能、尺寸要求（见4.1.2）和检验方法（见5.2.1和

5.2.4.1.1）；

e）更改了成像后液态耐电镀抗蚀剂最小线宽和线间距的要求（见4.2.1.1，2013年版的4.2.1）；

f）增加了成像后干膜光致抗蚀剂最小线宽和线间距要求（见4.2.1.2）；

g）更改了耐电镀性和耐化学镀性能要求（见4.2.2，2013年版的4.2.2）和检验方法（见5.6，2013年

版的5.7）；

h）更改了抗蚀刻性的要求（见4.2.3，2013年版的4.2.3）和检验方法（见5.7，2013年版的5.8）；

i）增加了曝光前后色差的要求（见4.2.4）和检验方法（见5.9）；

j）增加了曝光后干膜光致抗蚀剂层厚度的要求（见4.2.5）和检验方法（见5.2.4.1.2）；

k）增加了干膜光致抗蚀剂封孔性的要求（见4.2.6）和检验方法（见5.8）；

l）增加了干膜光致抗蚀剂填充能力的要求（见4.2.7）和检验方法（见5.12）；

m）增加了显影时间、退膜时间的要求（见4.2.8、4.2.9）和检验方法（见5.10、5.11）；

n）更改了试验图形设计和试样制作的要求（见5.1，2013年版的5.1）；

o）将鉴定检验调整为型式检验，并增加了干膜光致抗蚀剂的型式检验（见6.3，2013年版的6.3）；

p）将逐批检验调整为出厂检验，并增加了干膜光致抗蚀剂的出厂检验（见6.4，2013年版的6.4）；

q）删除了周期检验的要求（见2013年版的6.4.3）；

r）更改了液态耐电镀抗蚀剂的标志、包装、运输和贮存要求（见第7章，2013年版的第7章）；

s）增加了干膜光致抗蚀剂的标志、包装、运输和贮存要求（见第7章）；

t）删除了试样制造及相关数据的测试和计算（见2013年版的附录A）。

请注意本文件的某些内容可能涉及专利。本文件的发布机构不承担识别专利的责任。

本文件由全国半导体设备和材料标准化技术委员会（SAC/TC203）提出并归口。

本文件起草单位：广州兴森快捷电路科技有限公司、中国电子技术标准化研究院、湖南初源新材料

股份有限公司、杭州福斯特电子材料有限公司、深圳市容大感光科技股份有限公司、益阳市明正宏电子

有限公司、深圳市凌航达电子有限公司、深圳市贝加电子材料有限公司、恩达电路（深圳）有限公司。

本文件主要起草人：曹可慰、乔书晓、罗畅、梁权、张宝帅、史泽远、李伟杰、吴怡然、赵俊莎、

王俊峰、祝文华、王春文、李荣、程有和。

本文件及其所代替文件的历次版本发布情况为：

—2013年首次发布为GB/T29846—2013；

—本次为第一次修订。

Ⅲ

GB/T29846—2025

印制板用光成像耐电镀抗蚀剂

1范围

本文件规定了印制板用光成像耐电镀抗蚀剂的性能要求、检验规则、标志、包装、运输和贮存要

求，描述了相应的试验方法。

本文件适用于印制板制造用的光成像耐电镀、化学镀抗蚀剂，光成像耐酸性蚀刻、碱性蚀刻抗蚀剂。

2规范性引用文件

下列文件中的内容通过文中的规范性引用而构成本文件必不可少的条款。其中，注日期的引用文

件，仅该日期对应的版本适用于本文件；不注日期的引用文件，其最新版本（包括所有的修改单）适用

于本文件。

GB/T191包装储运图示标志

GB/T1724色漆、清漆和印刷油墨研磨细度的测定

GB/T2036印制电路术语

GB/T2421—2020环境试验概述和指南

GB/T4677—2002印制板测试方法

GB/T5547树脂整理剂黏度的测定

GB/T6672—2001塑料薄膜和薄片厚度测定机械测量法

GB/T13452.2—2008色漆和清漆漆膜厚度的测定

SJ/T10668电子组装技术术语

3术语和定义

GB/T2036和SJ/T10668界定的以及下列术语和定义适用于本文件。

3.1

耐电镀抗蚀剂platingandetchingresist

用于在制板形成电镀图形的抗蚀剂，通常是干膜或液态光致抗蚀剂或网印、打印的抗蚀油墨。

3.2

预干燥pre﹘drying

印制板用光成像耐电镀抗蚀剂由液态变为固态的过程。

3.3

耐电镀性platingresistance

印制板用光成像耐电镀抗蚀剂制成图形后其图形掩膜耐电镀的能力。

3.4

抗蚀刻性etchingresistance

印制板用光成像耐电镀抗蚀剂制成图形后其掩膜抗蚀刻的能力。

3.5

耐化学镀性chemicalplatingresistance

印制板用光成像耐电镀抗蚀剂制成图形后其图形掩膜耐化学镀的能力。

1