GB/T 48298.1-2026 半导体器件 汽车用半导体接口 第1部分:汽车传感器用电源接口通用要求
GB/T 48298.1-2026 Semiconductor devices—Semiconductor interface for automotive vehicles—Part 1:General requirements of power interface for automotive vehicle sensors
基本信息
本文件适用于汽车传感器用电源接口的测试和试验。
注:汽车传感器(以下简称“传感器”)用电源接口的补充信息见附录A。
发布历史
-
2026年10月
文前页预览
研制信息
- 起草单位:
- 上海复旦微电子集团股份有限公司、中国电子科技集团公司第十三研究所、四方光电股份有限公司、吉利汽车研究院(宁波)有限公司、上海芯物科技有限公司、中国电子技术标准化研究院、河北北芯半导体科技有限公司、嘉兴威凯检测技术有限公司、华东师范大学、中国电子科技集团公司第五十八研究所、东莞市信翰精密工业有限公司
- 起草人:
- 沈磊、崔波、刘山佳、刘志强、孙建军、刘岐、陈海蓉、温剑喜、费跃、刘若冰、尹丽晶、金伟斌、廉鹏飞、宋国栋、谢承志、王磊、赵清泉、李斌、柳逊、滕彤、张丽静、李鑫、范文轩、褚昆、富佳栋、郭晓宇、谢逸云
- 出版信息:
- 页数:20页 | 字数:25 千字 | 开本: 大16开
内容描述
ICS31.080.99
CCSL47
中华人民共和国国家标准
GB/T48298.1—2026
半导体器件汽车用半导体接口
第1部分:汽车传感器用电源接口通用要求
Semiconductordevices—Semiconductorinterfaceforautomotivevehicles—
Part1:Generalrequirementsofpowerinterfaceforautomotivevehiclesensors
(IEC62969⁃1:2017,MOD)
2026⁃10⁃30发布2027⁃05⁃01实施
国家市场监督管理总局
国家标准化管理委员会发布
GB/T48298.1—2026
目次
前言··························································································································Ⅲ
引言··························································································································Ⅳ
1范围·······················································································································1
2规范性引用文件········································································································1
3术语和定义··············································································································3
4一般系统·················································································································3
4.1一般系统框图·····································································································3
4.2分类·················································································································4
4.2.1传感器·········································································································4
4.2.2电源············································································································5
4.3数据接口···········································································································5
4.3.1总体要求······································································································5
4.3.2复位············································································································5
4.3.3监测············································································································5
5环境条件·················································································································6
5.1总体要求···········································································································6
5.2测试试验条件与项目····························································································6
5.2.1通用要求······································································································6
5.2.2温度范围······································································································6
5.2.3湿度············································································································7
5.2.4湿热············································································································7
5.2.5温度循环······································································································7
5.2.6机械碰撞和振动·····························································································7
5.2.7电磁兼容性···································································································7
5.2.8防护等级······································································································7
5.3测试装置···········································································································8
6电源接口检查项········································································································8
6.1输入电压值········································································································8
6.2主要误差源········································································································9
6.2.1交流噪声······································································································9
6.2.2压降············································································································9
6.3电源接口的冗余··································································································9
附录A(资料性)汽车传感器用电源接口总述···································································10
Ⅰ
GB/T48298.1—2026
参考文献····················································································································11
图1传感器的电能供应链······························································································4
图2测试和试验项目示例······························································································6
图3检查传感器电压值的测试示意图···············································································8
图4检查传感器的输入电压值(12V传感器)·····································································8
图A.1汽车中基于传感器的系统···················································································10
表1传感器分类··········································································································4
表2传感器的电源·······································································································5
Ⅱ
GB/T48298.1—2026
前言
本文件按照GB/T1.1—2020《标准化工作导则第1部分:标准化文件的结构和起草规则》的规定
起草。
本文件是GB/T48298《半导体器件汽车用半导体接口》的第1部分。GB/T48298已经发布了
以下部分:
——第1部分:汽车传感器用电源接口通用要求;
——第2部分:汽车传感器用谐振式无线功率传输系统效率评价方法;
——第3部分:汽车传感器用冲击驱动压电能量收集器;
——第4部分:汽车传感器用数据接口评价方法。
本文件修改采用IEC62969⁃1:2017《半导体器件汽车用半导体接口第1部分:汽车传感器用
电源接口通用要求》。
本文件与IEC62969⁃1:2017的技术差异及其原因如下:
——删除了规范性引用的IEC62132⁃3、IEC62132⁃5、IEC61967⁃5,因这三项标准已废止。
本文件做了下列编辑性改动:
——删除了ISO、IEC术语数据库网址。
请注意本文件的某些内容可能涉及专利。本文件的发布机构不承担识别专利的责任。
本文件由中华人民共和国工业和信息化部提出。
本文件由全国半导体器件标准化技术委员会(SAC/TC78)归口。
本文件起草单位:上海复旦微电子集团股份有限公司、中国电子科技集团公司第十三研究所、四方
光电股份有限公司、吉利汽车研究院(宁波)有限公司、上海芯物科技有限公司、中国电子技术标准化研
究院、河北北芯半导体科技有限公司、嘉兴威凯检测技术有限公司、华东师范大学、中国电子科技集团
公司第五十八研究所、东莞市信翰精密工业有限公司。
本文件主要起草人:沈磊、崔波、刘山佳、刘志强、孙建军、刘岐、陈海蓉、温剑喜、费跃、刘若冰、尹丽晶、
金伟斌、廉鹏飞、宋国栋、谢承志、王磊、赵清泉、李斌、柳逊、滕彤、张丽静、李鑫、范文轩、褚昆、富佳栋、
郭晓宇、谢逸云。
Ⅲ
GB/T48298.1—2026
引言
随着汽车半导体技术的快速发展,汽车半导体传感器已大规模应用于汽车的行驶、操控、安全、舒
适、智能等各类电子设备。因此,有必要针对半导体行业和汽车行业制定统一的汽车传感器相关标准,
指导半导体行业和汽车行业规范化开展技术应用,提升我国汽车半导体传感器技术的整体水平,同时
也规范相关市场和产品,带动整个产业朝着技术创新、功能创新的方向健康发展。
GB/T48298《半导体器件汽车用半导体接口》拟由四个部分构成。
——第1部分:汽车传感器用电源接口通用要求。目的在于规定汽车传感器用电源接口性能评估
和环境条件的通用要求。
——第2部分:汽车传感器用谐振式无线功率传输系统效率评价方法。目的在于规定评价汽车传
感器用谐振式无线功率传输系统效率的程序和定义。
——第3部分:汽车传感器用冲击驱动压电能量收集器。目的在于规定汽车传感器用冲击驱动压
电能量收集器的术语、定义、符号和结构,以及测试和试验方法。
——第4部分:汽车传感器用数据接口评价方法。目的在于规定评价汽车传感器用数据接口的故
障注入测试方法。
Ⅳ
GB/T48298.1—2026
半导体器件汽车用半导体接口
第1部分:汽车传感器用电源接口通用要求
1范围
本文件规定了汽车传感器用电源接口性能评估和环境条件的通用要求。
本文件适用于汽车传感器用电源接口的测试和试验。
注:汽车传感器(以下简称“传感器”)用电源接口的补充信息见附录A。
2规范性引用文件
下列文件中的内容通过文中的规范性引用而构成本文件必不可少的条款。其中,注日期的引用文
件,仅该日期对应的版本适用于本文件;不注日期的引用文件,其最新版本(包括所有的修改单)适用于
本文件。
IEC60068⁃2⁃1环境试验第2⁃1部分:试验试验A:低温(Environmentaltesting—Part2⁃1:
Tests—TestA:Cold)
注:GB/T2423.1—2008电工电子产品环境试验第2部分:试验方法试验A:低温(IEC60068⁃2⁃1:2007,IDT)
IEC60068⁃2⁃2环境试验第2⁃2部分:试验试验B:干热(Environmentaltesting—Part2⁃2:
Tests—TestB:Dryheat)
注:GB/T2423.2—2008电工电子产品环境试验第2部分:试验方法试验B:高温(IEC60068⁃2⁃2:2007,IDT)
IEC60068⁃2⁃14环境试验第2⁃14部分:试验试验N:温度变化(Environmentaltesting—Part2⁃14:
Tests—TestN:Changeoftemperature)
注:GB/T2423.22—2012环境试验第2部分:试验方法试验N:温度变化(IEC60068⁃2⁃14:2009,IDT)
IEC60068⁃2⁃30环境试验第2⁃30部分:试验试验Db:交变湿热(12h+12h循环)[Environ⁃
mentaltesting—Part2⁃30:Tests—TestDb:Dampheat,cyclic(12h+12hcycle)]
注:GB/T2423.4—2008电工电子产品环境试验第2部分:试验方法试验Db:交变湿热(12h+12h循环)
(IEC60068⁃2⁃30:2005,IDT)
IEC60529外壳防护等级(IP代码)[Degreesofprotectionprovidedbyenclosures(IPCode)]
注:GB/T4208—2017外壳防护等级(IP代码)(IEC60529:2013,IDT)
IEC60721(所有部分)环境条件分类(Classificationofenvironmentalconditions)
注1:GB/T4796.1—2017环境条件分类第1部分:环境参数及其严酷程度(IEC60721⁃1:2002,IDT)
注2:GB/T4797(所有部分)环境条件分类[IEC60721⁃2(所有部分)]
注3:GB/T4798(所有部分)环境条件分类[IEC60721⁃3(所有部分)]
注4:GB/T20159(所有部分)环境条件分类[IEC60721⁃4(所有部分)]
IEC60749⁃10半导体器件机械和气候试验方法第10部分:机械冲击器件和组件(Semi⁃
conductordevices—Mechanicalandclimatictestmethods—Part10:Mechanicalshock—Deviceandsubas⁃
sembly)
注:GB/T4937.10—2025半导体器件机械和气候试验方法第10部分:机械冲击器件和组件(IEC60749⁃10:
2022,IDT)
1
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