GB/T 44795-2024 系统级封装(SiP)一体化基板通用要求

ICS31.200

CCSL56

中华人民共和国国家标准

GB/T44795—2024

系统级封装（SiP）

一体化基板通用要求

Generalrequirementsforintegralsubstrate

ofSysteminPackage（SiP）

2024⁃10⁃26发布2024⁃10⁃26实施

国家市场监督管理总局

国家标准化管理委员会发布

GB/T44795—2024

目次

前言··························································································································Ⅲ

1范围·······················································································································1

2规范性引用文件········································································································1

3术语和定义··············································································································1

4总体要求·················································································································1

4.1通则·················································································································1

4.2文件优先顺序·····································································································1

4.3一体化基板类型··································································································2

5特性定义要求···········································································································2

5.1总则·················································································································2

5.2电气特性···········································································································2

5.3热特性··············································································································2

5.4结构特性···········································································································2

6设计要求·················································································································3

6.1总则·················································································································3

6.2一体化厚膜基板设计要求······················································································3

6.3一体化薄膜基板设计要求······················································································4

6.4一体化厚薄膜混合基板设计要求·············································································5

6.5一体化有机印制基板设计要求················································································6

7验证要求·················································································································7

7.1总则·················································································································7

7.2验证方案···········································································································7

7.3仿真模型···········································································································7

7.4试制验证···········································································································7

7.5建模提参···········································································································7

8制造要求·················································································································8

8.1总则·················································································································8

8.2验证与制造一致性·······························································································8

8.3关键工序与特殊过程····························································································8

8.4质量控制···········································································································8

8.5工艺模型库········································································································8

8.6环境要求···········································································································8

9检验要求·················································································································8

Ⅰ

GB/T44795—2024

9.1总则·················································································································8

9.2静态指标检验·····································································································9

9.3环境性能试验·····································································································9

10交付要求···············································································································9

10.1标识················································································································9

10.2文件··············································································································10

11产品转运、贮存要求································································································10

11.1转运··············································································································10

11.2贮存··············································································································10

附录A（资料性）基板设计典型参考值·············································································11

A.1一体化厚膜基板································································································11

A.2一体化薄膜基板································································································13

A.3一体化厚薄膜混合基板·······················································································15

A.4一体化有机印制基板··························································································15

参考文献····················································································································17

Ⅱ

GB/T44795—2024

前言

本文件按照GB/T1.1—2020《标准化工作导则第1部分：标准化文件的结构和起草规则》的规

定起草。

请注意本文件的某些内容可能涉及专利。本文件的发布机构不承担识别专利的责任。

本文件由中华人民共和国工业和信息化部提出。

本文件由全国集成电路标准化技术委员会（SAC/TC599）归口。

本文件起草单位：中国电子科技集团公司第二十九研究所、中国科学院微电子研究所、清华大学、

电子科技大学、厦门云天半导体科技有限公司、成都迈科科技股份有限公司。

本文件主要起草人：李彦睿、王春富、徐洋、边方胜、贾松良、于慧慧、季兴桥、陆吟泉、吕拴军、

秦跃利、徐榕青、向伟玮、王文博、张健、徐诺心、万里兮、于大全、张继华、李勇、龚小林、高明起、王娜、

张刚、张湉、徐飞。

Ⅲ

GB/T44795—2024

系统级封装（SiP）

一体化基板通用要求

1范围

本文件规定了系统级封装（SiP）一体化基板通用要求，包括一体化基板总体要求、特性定义、设计、

验证、制造、检验、交付、产品转运、贮存等方面要求。

本文件适用于系统级封装（SiP）中成为成品外壳整体一部分的底部基板。

2规范性引用文件

下列文件中的内容通过文中的规范性引用而构成本文件必不可少的条款。其中，注日期的引用文

件，仅该日期对应的版本适用于本文件；不注日期的引用文件，其最新版本（包括所有的修改单）适用于

本文件。

GB/T9178—1988集成电路术语

GB/T12842—1991膜集成电路和混合膜集成电路术语

GB/T44801—2024系统级封装（SiP）术语

3术语和定义

GB/T9178—1988、GB/T12842—1991和GB/T44801—2024界定的术语和定义适用于本文件。

4总体要求

4.1通则

系统级封装（SiP）一体化基板（以下简称“一体化基板”）要求包括。

a）技术要求，按产品流程一般可分为：

1）特性定义要求；

2）设计要求；

3）验证要求；

4）制造要求。

b）其他要求，包括但不限于：

1）检验要求；

2）交付要求；

3）产品转运、贮存要求。

除本文件规定的要求外，一体化基板其他要求应符合或超过其他相关规范性文件的特定应用等级

的所有要求。

4.2文件优先顺序

采用本文件或其他相关规范性文件时，优先顺序如下：

a）图纸、合同等产品采购文件；

1