GB/T 16464-1996 半导体器件 集成电路 第1部分：总则

ics31.200

L55臀8

中华人民共和国国家标准

GB/T16464一1996

IEC748-1:1984

半导体器件集成电路

第1部分:总则

Semiconductordevices

Integratedcircuits

Part1:General

1996一07一09发布1997-01一01实施

国家技术监督局发布

目次

第工篇IEC748号标准的范围和说明.·1

1范围···“，····，········································.·，··“········44··”，···.·，……1

2说明·1

第I篇IEC748-1号标准的目的和说明···········”···””··········..····.··“...·..·..·..·..·..·……1

1总则··············“·“”·“··················”·······················”··················”············.，·”·…1

2目的·····，””··········“‘“‘························，······················，·········“·“·”·······”····……1

3说明··‘··················“··“···，”·….，····“··‘“·”·········一1

第m篇IEC748-2号,IEC748-3号等标准的目的、说明和要求·······“········”······，·······…·…2

第N篇通用术语······”··········“·“·”·······················”·········”···········”················……2

1一般名词术语·一·2

2器件类型············“····“···············”············…·.…，’’·······.，·······”·······‘············“一3

3集成电路的籍位特性···””·“······‘······，”····.·.·.··一·.，..·.，.…‘.·…4

4工艺术语”····”·”·······“··············“··“···············”··“············“··.·，·“·”，···“···”一4

5膜集成电路和混合膜集成电路器件类型的术语··········“·“·······················“··“”···········“一5

第V篇通用文字符号···”··“··········““··“”·······················”·····”··”·····.·······..·..·.···……5

1基本文字符号”······“·“·······”···········“····”····················，··“·“·”·”·········，········”·…5

2数字集成电路的下标······“”·””························“····….…，······……，·...·..·……5

2.1电压和电流···”············”·“·················，，·”·”·······‘········，.，··············，”·······……5

2.2开关时间…，’’“··········“················“·················“·····”·················”··········……6

3模拟集成电路的下标·················”·，····························.·..·····.··········..·...·..·..·……7

第VI篇关于基本颇定值和电特性的一般规定····“···”···”·········，.··..·..·..·..·..·...‘……7

1引言············”······“·“·，·····”······”·············”·················，···············“··””，·········……7

2介绍发布资料的标准格式以及描述集成电路基本额定值、电特性和功能规范的方法，’······“·”·…7

2.1介绍发布资料的标准格式······“·············································”···········.·.·..·...·..‘…7

2.2描述集成电路基本额定值、电特性和功能规范的方法·”···················“······“········”··”·”…7

3额“定值’，的基本定义···”······················”···”·······················“·········“·········”·”·…8

4冷却条件的定义············，··”······”···“···················“·········，，···”······……，二，，.“...·……9

5优选温度一览表·g

6优选电压一览表········”······················”······”·····································”·“·”·…9

6.1用于推荐工作条件的优选标称电压一览表”····················.·..·..··.·.··..·..·..·……9

6.2电压允许偏差···”····”·，········““···········”········”········，···············……，.·..·..·..·“.…9

7机械额定值、特性和其他资料······”···“·································“·················.，，·...·..·一，9

8产品的离散性和一致性········”··“·”“············，·，··········‘······，···“······一·，·，·.”.“……9

9印制线和印制电路·········”···”···”·”·”··················“·“··…，····”·”······..·..·..·..·..·……9

10适用于所有种类集成电路的规范格式“·······“········““·······..····.“····.·..·..·……10

10.1总则···”···············“········“·······‘·，···················.，··.，··········“···········……10

10.2相关应用的描述···············.·，·····································“········.···.·..·.··.··.·……10

10.3功能规范·····························································································……10

10.4极限值(绝对最大额定值)······················································”··…·…。..·...……12

10.5工作条件·····································”···························.，·“·············一·13

10.6电特性·”·············”·······”·········”············”····”················“······““·.·，·“一14

10.7编程(适用时)·····································································..·..··.·..··.··.·……14

10.8机械和环境额定值，待性和其他资料···.，，······”································“····.·..·..·..·……14

10.9附加资料·······“···························································“······.·..··.·……14

第N篇通用测试方法”··················································”····”···.，·····.··.”.……15

1基本要求························································································……15

1.1引言·····················································.，··································.·，····.·，·…15

1.2一般注意事项······························································.，························……15

2测试方法的具体要求····················································”····“·“···············……15

3测试方法的编号体系······”·····“······“···············”······································..··.·……15

3.1编号原则···”·········”··.，“·····“·······························.，··”···············”···············……15

3.2集成电路测试方法的编号表··································“·，·······················.·..·..·..·……15

3.3应用表格····························”············“·“··········“··”········”·······“······”···”·…16

3.4修订······”······”···········“····················”····”·····································……17

第1s篇集成电路的验收和可靠性···“······“·····················”···”··········.·..·..·..·..·..·..·……17

第1节概述“17

第2节一般原理”··”···········”·”····”·“·”···“···········.·，······””··”··”··············“…17

第3节电耐久性试验17

1目的和说明··”··········”·”·”··““·······························”···············“·“············….…17

2一般要求·····”·················””·“····“·······“····“···················”·”··”··“····“···“……17

2.1电试验条件············································.·，················”··”···.·，············……17

2.2试验的持续时间.··..·……18

2.3失效判定特性和测试·”···············”····”··························”···············，···…·…18

2.4失效判据·························.，····“·······················”“·····““·“·······”···”···….…18

2.5注意事项···”·”··················”·“···················”··”····“······“·······”······”·”·”……18

3特殊要求“·“·······”····“·“····“··“····“································”···””····“··“···一·18

3.1耐久性试验表················”·········”········“···················”·····“.·.·..·..·..·..·..····”…18

3.2耐久性试验条件··········‘···““·······”····”·“···“····················.·，”··.·..·..·..·.·……，……18

3.3耐久性试验后，验收的失效判定特性和失效判据······················….…”·……”·……“…18

3.4可靠性试验的失效判定特性和失效判据·············”····················”········“······……18

3.5误试时处理程序·”·”······························.，·········”····················.···.···”···……18

第XI篇静电敏感器件····················································.···“...·..·..·..·..·..·..·..·……19

中华人民共和国国家标准

半导体器件集成电路

第1部分:总则GB/T16464一1996

IEC748-1:1984

Semiconductordevices

Integratedcircuits

Part1:General

本标准等同采用国际电工委员会标准IEC748-1:1984半《导体器件集成电路第1部分总则》，

其中包括1991年第1号修改单和1993年第2号修改单的内容。

第I篇IEC748号标准的范围和说明

范围

IEC748给出了有关集成电路的标准，应与IEC747-1一起使用。

说明

IEC748由分别颁发的IEC748-1号、IEC748-2号等几项标准组成。通过发布补充标准(例如IEC

748-2A)来适应发展的需要。

第I篇IEC748-1号标准的目的和说明

飞总则

IEC748-1号标准是748号标准的通用部分，和IEC747-1号标准的有关条款一起构成集成电路的

通用规定。

因此，IEC747-1号标准的所有条款只要适用于集成电路即可引用。

目的

提供有关IEC748号标准的范围和说明的通用内容(见第I篇)。

提供适用于IEC748-2号、748-3号等各类或各分类集成电路标准的一般原则或要求。

说明

有关一般原则或要求的内容在本标准的第，至第姐篇中给予说明。

注:本标准第.至第姐篇的内容:

第.篇:关于IEC748-2号、748-3号等标准的目的、说明和要求

第N篇:通用术语

除了IEC747-1号标准第N篇中已经给出的术语外，还包括一系列有关集成电路的基本术语和定义。

第V篇:通用文字符号

国家技术监督局1996一07一09批准1997一01一Digs

BGr/'16464一1996

除了747-1号标准第V篇中已经给出的文字符号外，还规定了适用于集成电路的文字符号体系。

第”篇关于基本额定值和电特性的一般规定

提供了有关电、热和机械要求的通用条款(不同于747-1号标准第VI篇中有关分立器件的相应条款)

第N篇:通用测定方法

说明测试方法的编号体系和应用表格.

提供集成电路所有测试方法的一览表

第VI篇:集成电路的验收和可靠性

对集成电路的总的要求，并对各类或各分类集成电路应给出的特殊要求作了说明。

第11篇IEC748-2号、IEC748-3号等标准的

目的、说明和要求(尚在考虑中)

注:目前，应尽可能地应用IEC747-1号标准的第，篇。

第N篇通用米语

引用IEC747-1号标准第N篇中适用于集成电路的有关条款。未在IEC747-1中给出的其它必要

的通用名词术语和定义在下面的第1章和第2章中列出。为了完整起见，IEC747-1号标准中一些基本

名词术语和定义在这里重新列出。

1一般名词术语

1.1(半导体器件的)引出端terminal(ofasemiconductordevice)(重复IEC747-1号标准第N篇第

3.1条)

规定的外部有效的连接点。

注:该定义正在修改中

1.2(半导体器件的)电极。Iectrode(ofasemiconductordevice)(重复IEC747-1号标准第N篇第

3.2条)

在半导体器件的规定部位与接到引出端上的引线之间提供电接触的部分。

往:该定义正在修改中。

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