GB/T 44919-2024 微机电系统(MEMS)技术 薄膜力学性能的鼓胀试验方法

ICS

31.080.99

CCS

L59

中华人民共和国国家标准

GB/T44919—2024/IEC62047﹘17:2015

微机电系统（MEMS）技术

薄膜力学性能的鼓胀试验方法

Micro-electromechanicalsystems(MEMS)technology—

Bulgetestmethodformeasuringmechanical

propertiesofthinfilms

（IEC62047-17:2015,Semiconductordevices—Micro-electromechanical

devices—Part17:Bulgetestmethodformeasuring

mechanicalpropertiesofthinfilms,IDT）

2024-11-28发布2024-11-28实施

国家市场监督管理总局发布

国家标准化管理委员会

GB/T44919—2024/IEC62047﹘17:2015

目次

1

范围

··································································································

1

2

规范性引用文件

······················································································

1

3

术语、定义和符号

····················································································

1

3.1

术语和定义

······················································································

1

3.2

符号

······························································································

2

4

鼓胀测试原理

·························································································

2

5

测试装置和测试环境

·················································································

3

5.1

通则

······························································································

3

5.2

装置

······························································································

3

5.3

测试环境

·························································································

4

6

试样

··································································································

4

6.1

通则

······························································································

4

6.2

试样形状和尺寸

·················································································

4

6.3

试样尺寸测量

····················································································

5

7

测试程序和分析

······················································································

5

7.1

测试程序

·························································································

5

7.2

数据分析

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6

8

测试报告

······························································································

7

附录A（资料性）力学特性的测定

···································································

8

A.1

概述

·····························································································

8

A.2

使用应力﹘应变曲线测定力学特性

·······························································

8

A.3

使用荷载﹘挠度分析测定力学特性

·······························································

9

附录B（资料性）形变测量技术

·····································································

11

B.1

概述

····························································································

11

B.2

激光干涉技术

··················································································

11

B.3

电容式测量

·····················································································

11

附录C（资料性）试样制造示例：MEMS工艺

·····················································

16

C.1

试样制造

·······················································································

16

C.2

试样形状测量

··················································································

16

参考文献

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17

Ⅰ

GB/T44919—2024/IEC62047﹘17:2015

前言

本文件按照GB/T1.1—2020《标准化工作导则

第1部分：标准化文件的结构和起草规则》的规

定起草。

本文件等同采用IEC62047﹘17:2015《半导体器件

微机电器件

第17部分：薄膜机械性能的打压

试验方法》。

本文件做了下列最小限度的编辑性改动：

—为与现有标准协调，将标准名称改为《微机电系统（MEMS）技术

薄膜力学性能的鼓胀试验

方法》；

—更正了国际标准中的印刷错误，将6.1中参考“附录B”改为“附录C”。

请注意本文件的某些内容可能涉及专利。本文件的发布机构不承担识别专利的责任。

本文件由全国微机电技术标准化技术委员会（SAC/TC336）提出并归口。

本文件起草单位：中国科学院微电子研究所、中机生产力促进中心有限公司、苏州容启传感器科技

有限公司、武汉大学、北京大学、昆山昆博智能感知产业技术研究院有限公司、苏州晶方半导体科技股

份有限公司、苏州慧闻纳米科技有限公司、工业和信息化部电子第五研究所、深圳市美思先端电子有限

公司、东南大学、芯联集成电路制造股份有限公司、中关村光电产业协会、华东电子工程研究所（中国

电子科技集团公司第三十八研究所）、上海交通大学、明石创新（烟台）微纳传感技术研究院有限公

司、武汉高德红外股份有限公司。

本文件主要起草人：周维虎、李根梓、孙宏霖、刘胜、霍树春、高成臣、焦斌斌、陈立国、杨剑宏、

张平平、陈志文、陈思、马龙全、黄庆安、聂萌、谢红梅、陈晓梅、卢永红、张红旗、刘景全、高峰、

黄晟。

Ⅲ

GB/T44919—2024/IEC62047﹘17:2015

微机电系统（MEMS）技术

薄膜力学性能的鼓胀试验方法

1范围

本文件描述了窗口薄膜的鼓胀测试方法。试样由微米/纳米结构薄膜材料制备，包括金属、陶瓷和

聚合物等薄膜，用于微机电系统（MEMS）、微机械等领域。薄膜厚度范围为0.1μm～10μm。正方形

和长方形窗口宽度范围0.5mm～4mm，圆形窗口直径范围0.5mm～4mm。

本文件适用于常温环境条件下，对窗口薄膜试样施加均匀压力进行弹性模量和残余应力测试。

2规范性引用文件

下列文件中的内容通过文中的规范性引用而构成本文件必不可少的条款。其中，注日期的引用文

件，仅该日期对应的版本适用于本文件；不注日期的引用文件，其最新版本（包括所有的修改单）适用

于本文件。

IEC62047﹘2:2006半导体器件微机电器件第2部分：薄膜材料的拉伸试验方法（Semicon﹘

ductordevices—Micro﹘electromechanicaldevices—Part2:Tensiletestingmethodofthinfilmmateri﹘

als）

3术语、定义和符号

3.1术语和定义

下列术语和定义适用于本文件。

3.1.1

残余应力residualstress

σ0

在没有外部载荷的情况下，试样中存在的应力。

3.1.2

双轴模量biaxialmodulus

M

平面应变条件下的弹性模量。

3.1.3

窗口薄膜membranewindow

与施压介质直接接触的、无支撑结构的薄膜试样被测区域。

注：见图1。

1