GB/T 48099-2026 半导体封装用带预制焊环盖板

GB/T 48099-2026 Lid with preform for semiconductor packages

国家标准 中文简体 即将实施 页数:60页 | 格式:PDF

基本信息

标准号
GB/T 48099-2026
标准类型
国家标准
标准状态
即将实施
中国标准分类号(CCS)
国际标准分类号(ICS)
发布日期
2026-08-28
实施日期
2027-03-01
发布单位/组织
国家市场监督管理总局、国家标准化管理委员会
归口单位
全国集成电路标准化技术委员会(SAC/TC 599)
适用范围
本文件规定了半导体封装用带预制焊环盖板的型号分类和标识,技术要求,检验规则,包装、标志、运输及贮存、说明事项,描述了检验方法。
本文件适用于密封半导体器件用带预制焊环盖板。

发布历史

文前页预览

研制信息

起草单位:
中国电子科技集团公司第五十八研究所、中国电子技术标准化研究院、宜兴市吉泰电子有限公司、江苏省宜兴电子器件总厂有限公司、积高电子(无锡)有限公司
起草人:
丁荣峥、何晟、肖汉武、李秀林、曹忞忞、史丽英、王琪、严志良、安琪、佘福良
出版信息:
页数:60页 | 字数:98 千字 | 开本: 大16开

内容描述

ICS31.030

CCSL90

中华人民共和国国家标准

GB/T48099—2026

半导体封装用带预制焊环盖板

Lidwithpreformforsemiconductorpackages

2026⁃08⁃28发布2027⁃03⁃01实施

国家市场监督管理总局

国家标准化管理委员会发布

GB/T48099—2026

目次

前言··························································································································Ⅲ

1范围·······················································································································1

2规范性引用文件········································································································1

3术语和定义··············································································································2

4型号分类和标识········································································································3

4.1概述·················································································································3

4.2盖板材料分类与代码····························································································3

4.3盖板形状分类与代码····························································································3

4.4焊环材料及固定方式····························································································3

4.5密封环尺寸········································································································4

4.6扩展项··············································································································4

4.7带预制焊环盖板型号分类和标识示例·······································································4

5技术要求·················································································································5

5.1材料·················································································································5

5.2设计和结构········································································································6

5.3光特性(适用时)·································································································12

5.4外观质量··········································································································12

5.5盖板镀覆··········································································································12

5.6镀层质量··········································································································13

5.7密封················································································································13

5.8盐雾(腐蚀)·······································································································13

5.9润湿性·············································································································13

5.10方向识别标志··································································································13

5.11可追溯性、信息交换及失效报警············································································13

6检验方法···············································································································13

6.1材料················································································································13

6.2设计和结构·······································································································14

6.3光特性(适用时)·································································································14

6.4外观质量··········································································································14

6.5盖板镀覆··········································································································14

6.6镀层质量··········································································································14

6.7密封················································································································14

6.8盐雾(腐蚀)·······································································································14

Ⅰ

GB/T48099—2026

6.9润湿性·············································································································15

7检验规则···············································································································15

7.1检验分类··········································································································15

7.2检验条件··········································································································15

7.3批的组成··········································································································15

7.4定型检验(鉴定检验)···························································································15

7.5出厂检验··········································································································17

7.6型式检验··········································································································18

7.7检验设备故障或操作失误时处理程序······································································19

8包装、标志、运输及贮存检验·······················································································19

8.1包装················································································································19

8.2包装标志··········································································································20

8.3运输和贮存·······································································································20

9说明事项···············································································································21

9.1预定用途··········································································································21

9.2订购文件··········································································································21

附录A(规范性)带预制焊环盖板外观质量要求································································22

A.1目的···············································································································22

A.2术语和定义······································································································22

A.3检验···············································································································23

附录B(规范性)镀层质量试验方法···············································································40

B.1镀金层质量试验方法··························································································40

B.2镀镍层质量试验方法··························································································40

附录C(规范性)带预制焊环盖板润湿性试验方法·····························································42

C.1目的···············································································································42

C.2方法1:盖板与外壳/底座熔封法············································································42

C.3方法2:熔融法··································································································45

附录D(规范性)自由跌落···························································································48

D.1目的···············································································································48

D.2试验设备·········································································································48

D.3试验程序·········································································································49

D.4合格判据·········································································································49

参考文献····················································································································50

Ⅱ

GB/T48099—2026

前言

本文件按照GB/T1.1—2020《标准化工作导则第1部分:标准化文件的结构和起草规则》的规

定起草。

请注意本文件的某些内容可能涉及专利。本文件的发布机构不承担识别专利的责任。

本文件由全国集成电路标准化技术委员会(SAC/TC599)提出并归口。

本文件起草单位:中国电子科技集团公司第五十八研究所、中国电子技术标准化研究院、宜兴市吉

泰电子有限公司、江苏省宜兴电子器件总厂有限公司、积高电子(无锡)有限公司。

本文件主要起草人:丁荣峥、何晟、肖汉武、李秀林、曹忞忞、史丽英、王琪、严志良、安琪、佘福良。

Ⅲ

GB/T48099—2026

半导体封装用带预制焊环盖板

1范围

本文件规定了半导体封装用带预制焊环盖板的型号分类和标识,技术要求,检验规则,包装、标志、

运输及贮存、说明事项,描述了检验方法。

本文件适用于密封半导体器件用带预制焊环盖板。

2规范性引用文件

下列文件中的内容通过文中的规范性引用而构成本文件必不可少的条款。其中,注日期的引用文

件,仅该日期对应的版本适用于本文件;不注日期的引用文件,其最新版本(包括所有的修改单)适用于

本文件。

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