GB/T 48099-2026 半导体封装用带预制焊环盖板
GB/T 48099-2026 Lid with preform for semiconductor packages
基本信息
本文件适用于密封半导体器件用带预制焊环盖板。
发布历史
-
2026年08月
文前页预览
研制信息
- 起草单位:
- 中国电子科技集团公司第五十八研究所、中国电子技术标准化研究院、宜兴市吉泰电子有限公司、江苏省宜兴电子器件总厂有限公司、积高电子(无锡)有限公司
- 起草人:
- 丁荣峥、何晟、肖汉武、李秀林、曹忞忞、史丽英、王琪、严志良、安琪、佘福良
- 出版信息:
- 页数:60页 | 字数:98 千字 | 开本: 大16开
内容描述
ICS31.030
CCSL90
中华人民共和国国家标准
GB/T48099—2026
半导体封装用带预制焊环盖板
Lidwithpreformforsemiconductorpackages
2026⁃08⁃28发布2027⁃03⁃01实施
国家市场监督管理总局
国家标准化管理委员会发布
GB/T48099—2026
目次
前言··························································································································Ⅲ
1范围·······················································································································1
2规范性引用文件········································································································1
3术语和定义··············································································································2
4型号分类和标识········································································································3
4.1概述·················································································································3
4.2盖板材料分类与代码····························································································3
4.3盖板形状分类与代码····························································································3
4.4焊环材料及固定方式····························································································3
4.5密封环尺寸········································································································4
4.6扩展项··············································································································4
4.7带预制焊环盖板型号分类和标识示例·······································································4
5技术要求·················································································································5
5.1材料·················································································································5
5.2设计和结构········································································································6
5.3光特性(适用时)·································································································12
5.4外观质量··········································································································12
5.5盖板镀覆··········································································································12
5.6镀层质量··········································································································13
5.7密封················································································································13
5.8盐雾(腐蚀)·······································································································13
5.9润湿性·············································································································13
5.10方向识别标志··································································································13
5.11可追溯性、信息交换及失效报警············································································13
6检验方法···············································································································13
6.1材料················································································································13
6.2设计和结构·······································································································14
6.3光特性(适用时)·································································································14
6.4外观质量··········································································································14
6.5盖板镀覆··········································································································14
6.6镀层质量··········································································································14
6.7密封················································································································14
6.8盐雾(腐蚀)·······································································································14
Ⅰ
GB/T48099—2026
6.9润湿性·············································································································15
7检验规则···············································································································15
7.1检验分类··········································································································15
7.2检验条件··········································································································15
7.3批的组成··········································································································15
7.4定型检验(鉴定检验)···························································································15
7.5出厂检验··········································································································17
7.6型式检验··········································································································18
7.7检验设备故障或操作失误时处理程序······································································19
8包装、标志、运输及贮存检验·······················································································19
8.1包装················································································································19
8.2包装标志··········································································································20
8.3运输和贮存·······································································································20
9说明事项···············································································································21
9.1预定用途··········································································································21
9.2订购文件··········································································································21
附录A(规范性)带预制焊环盖板外观质量要求································································22
A.1目的···············································································································22
A.2术语和定义······································································································22
A.3检验···············································································································23
附录B(规范性)镀层质量试验方法···············································································40
B.1镀金层质量试验方法··························································································40
B.2镀镍层质量试验方法··························································································40
附录C(规范性)带预制焊环盖板润湿性试验方法·····························································42
C.1目的···············································································································42
C.2方法1:盖板与外壳/底座熔封法············································································42
C.3方法2:熔融法··································································································45
附录D(规范性)自由跌落···························································································48
D.1目的···············································································································48
D.2试验设备·········································································································48
D.3试验程序·········································································································49
D.4合格判据·········································································································49
参考文献····················································································································50
Ⅱ
GB/T48099—2026
前言
本文件按照GB/T1.1—2020《标准化工作导则第1部分:标准化文件的结构和起草规则》的规
定起草。
请注意本文件的某些内容可能涉及专利。本文件的发布机构不承担识别专利的责任。
本文件由全国集成电路标准化技术委员会(SAC/TC599)提出并归口。
本文件起草单位:中国电子科技集团公司第五十八研究所、中国电子技术标准化研究院、宜兴市吉
泰电子有限公司、江苏省宜兴电子器件总厂有限公司、积高电子(无锡)有限公司。
本文件主要起草人:丁荣峥、何晟、肖汉武、李秀林、曹忞忞、史丽英、王琪、严志良、安琪、佘福良。
Ⅲ
GB/T48099—2026
半导体封装用带预制焊环盖板
1范围
本文件规定了半导体封装用带预制焊环盖板的型号分类和标识,技术要求,检验规则,包装、标志、
运输及贮存、说明事项,描述了检验方法。
本文件适用于密封半导体器件用带预制焊环盖板。
2规范性引用文件
下列文件中的内容通过文中的规范性引用而构成本文件必不可少的条款。其中,注日期的引用文
件,仅该日期对应的版本适用于本文件;不注日期的引用文件,其最新版本(包括所有的修改单)适用于
本文件。
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GB/T2828.1—2012计数抽样检验程序第1部分:按接收质量限(AQL)检索的逐批检验抽样
计划
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GB/T4937.13半导体器件机械和气候试验方法第13部分:盐雾
GB/T4937.24半导体器件机械和气候试验方法第24部分:加速耐湿无偏置强加速应力
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GB/T36176—2018真空技术氦质谱真空检漏方法
GB/T41897食品用干燥剂质量要求
SJ/T10858—1996玻璃及铬版表面平整度的测试方法
YB/T5231定膨胀封接铁镍钴合金
YB/T5235定膨胀封接铁镍铬、铁镍合金
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