GB/T 44375-2024 300 mm半导体设备装载端口要求

ICS

31.260

CCS

L97

中华人民共和国国家标准

GB/T44375—2024

300mm半导体设备装载端口要求

Requirementsforloadportsof300mmsemiconductorequipment

2024-08-23发布2025-03-01实施

国家市场监督管理总局发布

国家标准化管理委员会

GB/T44375—2024

目次

前言

·····································································································

Ⅲ

1

范围

··································································································

1

2

规范性引用文件

······················································································

1

3

术语和定义

···························································································

1

4

要求

··································································································

2

4.1

接口尺寸要求

····················································································

2

4.2

装载端口配置选项

···············································································

4

4.3

装载端口排序规则

···············································································

4

4.4

晶圆承载器装载/卸载尺寸要求

··································································

6

4.5

感应地面搬运系统的光电传感器安装位置尺寸要求

·············································

6

4.6

ID读取器专属空间尺寸要求

·····································································

7

4.7

晶圆承载器取放机构专属空间尺寸要求

·························································

9

Ⅰ

GB/T44375—2024

前言

本文件按照GB/T1.1—2020《标准化工作导则第1部分：标准化文件的结构和起草规则》的规

定起草。

请注意本文件的某些内容可能涉及专利。本文件的发布机构不承担识别专利的责任。

本文件由全国半导体设备和材料标准化技术委员会（SAC/TC203）提出并归口。

本文件起草单位：上海微电子装备（集团）股份有限公司、中国电子技术标准化研究院、北京北方

华创微电子装备有限公司、中微半导体设备(上海)股份有限公司、漳州市太龙照明工程有限公司、深圳

市埃芯半导体科技有限公司、苏州镁伽科技有限公司、中电鹏程智能装备有限公司。

本文件主要起草人：胡松立、李运锋、吴怡然、曹可慰、赵俊莎、周晓锋、李殿浦、武小娟、

朱明、李英、张宝帅、洪峰、张志勇、乔志新、王鸣昕。

Ⅲ

GB/T44375—2024

300mm半导体设备装载端口要求

1范围

本文件规定了300mm晶圆半导体设备装载端口的尺寸要求，主要包括半导体设备与产线之间的物

理接口。

本文件适用于半导体设备设计与制造领域。

2规范性引用文件

本文件没有规范性引用文件。

3术语和定义

下列术语和定义适用于本文件。

3.1

片架cassette

承载一个或多个晶圆的开放式结构。

3.2

装载面loadfaceplane

在设备上用于执行装载的一侧（或多侧），距离片架质心或晶圆承载器质心直线距离最远的物理垂

直平面。

3.3

装载端口loadport

设备上传输晶圆承载器的接口位置。

3.4

倾斜度tilt

为了保持晶圆排列整齐或防止滑出，在片架或晶圆承载器的标准水平或垂直方向上，设计的角度

偏移。

注：标准水平方向是指垂直于装载面的方向。

3.5

晶圆承载器wafercarrier

存放晶圆的片架、前开口片盒、SMIF（标准机械接口）片盒、晶舟等承载器。

1