GB/Z 41275.1-2026 航空电子过程管理 含无铅焊料航空航天及国防电子系统 第1部分：无铅控制计划的编制

ICS49.025

CCSV25

中华人民共和国国家标准化指导性技术文件

GB/Z41275.1—2026/IEC/TS62647⁃1：2012

航空电子过程管理

含无铅焊料航空航天及国防电子系统

第1部分：无铅控制计划的编制

Processmanagementforavionics—Aerospaceanddefenceelectronicsystems

containinglead⁃freesolder—Part1：Preparationforalead⁃freecontrolplan

（IEC/TS62647⁃1：2012，IDT）

2026⁃07⁃30发布

国家市场监督管理总局

发布

国家标准化管理委员会

GB/Z41275.1—2026/IEC/TS62647⁃1：2012

目次

前言··························································································································Ⅲ

引言··························································································································Ⅳ

1范围·······················································································································1

2规范性引用文件········································································································1

3术语和定义··············································································································2

4缩略语····················································································································4

5目标·······················································································································5

5.1总则·················································································································5

5.2可靠性··············································································································5

5.3构型控制和产品标识····························································································5

5.4COTS组件或子组件····························································································5

5.5锡须的有害影响··································································································5

5.6修复、返工、维护和保障·························································································5

6技术要求·················································································································5

6.1通则·················································································································5

6.2可靠性··············································································································6

6.3构型控制和产品标识····························································································7

6.4COTS组件和子组件····························································································8

6.5锡须的有害影响··································································································9

6.6修复、返工、维护和保障·························································································9

7计划管理要求···········································································································9

7.1计划组织···········································································································9

7.2计划中使用的术语和定义······················································································9

7.3计划沟通···········································································································9

7.4支持文件···········································································································9

7.5对供应商与分包商的要求······················································································9

7.6计划批准···········································································································9

7.7计划更改···········································································································9

附录A（资料性）本文件剪裁要求模板············································································10

附录B（资料性）本文件的要求矩阵···············································································11

附录C（资料性）构型控制和产品标识指南······································································14

C.1总则···············································································································14

C.2概述···············································································································14

Ⅰ

GB/Z41275.1—2026/IEC/TS62647⁃1：2012

C.3相关文件·········································································································14

C.4构型控制和产品标识··························································································15

参考文献····················································································································20

Ⅱ

GB/Z41275.1—2026/IEC/TS62647⁃1：2012

前言

本文件为规范类指导性技术文件。

本文件按照GB/T1.1—2020《标准化工作导则第1部分：标准化文件的结构和起草规则》的规定

起草。

本文件是GB/T（Z）41275《航空电子过程管理含无铅焊料航空航天及国防电子系统》的第1部

分。GB/T（Z）41275已经发布了以下部分：

——第1部分：无铅控制计划的编制；

——第2部分：减少锡有害影响；

——第3部分：含无铅焊料和无铅管脚的系统性能试验方法；

——第4部分：球栅阵列植球；

——第21部分：向无铅电子过渡指南；

——第22部分：技术指南；

——第23部分：无铅及混装电子产品返工/修复指南。

本文件等同采用IEC/TS62647⁃1：2012《航空电子过程管理含无铅焊料的航空航天和国防电子

系统第1部分：无铅控制计划的编制》，文件类型由IEC的技术规范调整为我国的国家标准化指导性

技术文件。

本文件做了下列最小限度的编辑性改动：

——第4章增加缩略语“PCB”；

——删除了6.2.4中“注1”和与其内容对应的第4章缩略语“JCAA/JG⁃PP”。

请注意本文件的某些内容可能涉及专利。本文件的发布机构不承担识别专利的责任。

本文件由全国航空电子过程管理标准化技术委员会（SAC/TC427）提出并归口。

本文件起草单位：成都凯天电子股份有限公司、中航通飞华南飞机工业有限公司、中国直升机设计

研究所、成都飞机工业（集团）有限责任公司。

本文件主要起草人：杜柳、包蕾蕾、王咏梅、郭南英、张智斌、刘姝、余永华、刘纯丽、熊亮、代勇波、刘辉。

Ⅲ

GB/Z41275.1—2026/IEC/TS62647⁃1：2012

引言

GB/T（Z）41275规定了航空航天、国防和高性能电子系统实现无铅化的管理要求与技术要求，拟

由7个部分构成。

——第1部分：无铅控制计划的编制。目的在于规定航空航天、国防和高性能电子系统编制无铅

控制计划的目标和要求。

——第2部分：减少锡有害影响。目的在于规定航空航天、国防和高性能电子系统为减少锡有害

影响而采取的技术方法。

——第3部分：含无铅焊料和无铅管脚的系统性能试验方法。目的在于规定含无铅焊料和无铅管

脚的航空航天、国防和高性能电子系统的性能试验方法与试验规程。

——第4部分：球栅阵列植球。目的在于规定含无铅焊料和无铅管脚的航空航天、国防和高性能

电子系统更换球栅阵列（BGA）元器件焊球的要求。

——第21部分：向无铅电子过渡指南。目的在于规定航空航天、国防电子系统项目管理层或系统

工程管理层管理向无铅电子过渡的工作指南。

——第22部分：技术指南。目的在于规定航空航天、国防和高性能电子系统确保持续性能、质量、

可靠性、安全性、适航性、构型控制、可负担性、可维护性和可支持性的技术指南。

——第23部分：无铅及混装电子产品返工/修复指南。目的在于规定航空航天、国防和高性能电

子系统在返工/修复过程中拆卸和更换零件（含元器件）的技术指南。

随着全球很多地区和国家颁布了有害物质限制指令（RoHS），许多航空航天、国防和高性能（ADHP）

电子系统行业的供应商开发使用了无铅技术，而无铅技术应用于ADHP电子系统存在以下风险：

——在某些使用条件下，由于无铅焊料在热循环和振动下的疲劳特性可能与传统焊料存在差异，

其使用可能会影响电气互连性能；

——使用纯锡等无铅镀层可能会导致锡须形成，进而可能造成不同程度的产品和系统故障；

——无铅技术的使用可能会导致与无铅焊料相关的更高加工温度。

基于上述风险，制定“无铅控制计划（LFCP，简称计划）的编制”文件，明确在ADHP电子系统行业

范围内应用无铅技术的要求。

Ⅳ

GB/Z41275.1—2026/IEC/TS62647⁃1：2012

航空电子过程管理

含无铅焊料航空航天及国防电子系统

第1部分：无铅控制计划的编制

1范围

本文件规定了过程文件编制的目标和要求，这些过程旨在向顾客和监管机构证明，含无铅焊料、无

铅零部件和印制线路板（PWB）的航空航天、国防和高性能（ADHP）电子系统，在规定的全寿命周期内

能满足性能、可靠性、适航性、安全性和可认证性的适用要求。

本文件旨在明确无铅控制计划（LFCP）（以下简称“计划”）的要求，并帮助计划负责方制定计划。

该计划记录了计划负责方的相关过程，以向其顾客和所有其他利益相关方保证，针对引言所述风险，计

划负责方的产品仍能持续满足各方要求。

本文件不包含文件化过程的详细描述，仅列出了此类过程的顶层要求，以及ADHP行业通过过程

解决的重点关注领域。

无铅风险管理宜通过在计划负责方现有的产品管理与控制体系中增加特定要求的方式来实现。

本文件适用于ADHP电子系统供应链。

无铅活动的管控由计划负责方负责落实，以满足其顾客的需求。这些活动包括但不限于：由系统

集成商、原始设备制造商（OEM）及其各自的供应链向下游尽可能延伸执行。宜明确的是：在元器件层

级，航空航天行业不必对这些供应商施加重大影响，在此情况下，相关责任由计划负责方承担。

部分应用可能存在超出本文件范围的特殊要求，此类扩展范围宜单独进行规定。

本文件的要求根据特定项目的独特需求进行剪裁。若进行剪裁，用户需获取顾客的书面认可。

附录A提供了可使用的剪裁模板。

其他高性能和高可靠性电子行业参考使用。

2规范性引用文件

下列文件中的内容通过文中的规范性引用而构成为本文件必不可少的条款。其中，注日期的引用

文件，仅该日期对应的版本适用于本文件；不注日期的引用文件，其最新版本（包括所有的修改单）适用

于本文件。

IEC/TS62647⁃2航空电子过程管理含无铅焊料航空航天及国防电子系统第2部分：减少锡

有害影响（Processmanagementforavionics—Aerospaceanddefenceelectronicsystemscontaininglead⁃

freesolder—Part2：Mitigationofdeleteriouseffectsoftin）

注：GB/T41275.2—2022航空电子过程管理含无铅焊料航空航天及国防电子系统第2部分：减少锡有害影

响（IEC/TS62647⁃2：2012，MOD）

IEC/TS62647⁃22航空电子过程管理含无铅焊料航空航天及国防电子系统第22部分：技术

指南（Processmanagementforavionics—Aerospaceanddefenceelectronicsystemscontaininglead⁃free

solder—Part22：Technicalguidelines）

注：GB/Z41275.22—2023航空电子过程管理含无铅焊料航空航天及国防电子系统第22部分：技术指南

（IEC/TS62647⁃22：2013，MOD）

IEC/TS62647⁃23航空电子过程管理含无铅焊料航空航天及国防电子系统第23部分：无铅

1