GB/T 6346.21-2026 电子设备用固定电容器 第21部分：分规范 表面安装用1类多层瓷介固定电容器

ICS31.060.10

CCSL11

中华人民共和国国家标准

GB/T6346.21—2026/IEC60384⁃21：2024

代替GB/T21041—2007

电子设备用固定电容器

第21部分：分规范

表面安装用1类多层瓷介固定电容器

Fixedcapacitorsforuseinelectronicequipment—

Part21：Sectionalspecification—

Fixedsurfacemountmultilayercapacitorsofceramicdielectric，Class1

（IEC60384⁃21：2024，IDT）

2026⁃09⁃28发布2027⁃04⁃01实施

国家市场监督管理总局

国家标准化管理委员会发布

GB/T6346.21—2026/IEC60384⁃21：2024

目次

前言··························································································································Ⅴ

引言··························································································································Ⅶ

1范围·······················································································································1

2规范性引用文件········································································································1

3术语和定义··············································································································1

4优先额定值和特性·····································································································2

4.1优先特性···········································································································2

4.2优先额定值········································································································3

5试验和测量程序········································································································5

5.1通则·················································································································5

5.2预干燥··············································································································6

5.3测量条件···········································································································6

5.4安装·················································································································6

5.5外观和尺寸检查··································································································6

5.6电气试验···········································································································7

5.7温度系数（α）和电容量温度循环漂移·······································································10

5.8剪切试验··········································································································10

5.9基板弯曲试验····································································································10

5.10耐焊接热········································································································11

5.11可焊性···········································································································12

5.12温度快速变化··································································································13

5.13气候顺序········································································································14

5.14恒定湿热········································································································15

5.15耐久性···········································································································16

5.16引出端强度（仅对带式引出端）·············································································18

5.17元件耐溶剂性（要求时）······················································································18

5.18标志耐溶剂（要求时）·························································································18

5.19加速恒定湿热（要求时）······················································································18

6标志·····················································································································19

6.1通则················································································································19

6.2标志内容··········································································································19

6.3电容器本体标志·································································································20

6.4标志要求··········································································································20

Ⅰ

GB/T6346.21—2026/IEC60384⁃21：2024

6.5包装标志··········································································································20

6.6附加标志··········································································································20

7详细规范中应规定的内容··························································································20

7.1通则················································································································20

7.2外形图和尺寸····································································································20

7.3安装················································································································20

7.4额定值和特性····································································································20

7.5标志················································································································21

8质量评定程序·········································································································21

8.1制造初始阶段····································································································21

8.2结构相似元件····································································································21

8.3放行批合格证明记录···························································································21

8.4鉴定批准··········································································································21

附录A（规范性）表面安装用1类多层瓷介固定电容器尺寸代码规范导则·······························27

附录B（规范性）温度系数及其允许偏差（以25℃为基准温度）·············································28

附录C（规范性）质量一致性检验··················································································29

C.1检验批的构成···································································································29

C.2试验一览表······································································································29

C.3延期交货·········································································································29

C.4评定水平·········································································································29

C.5质量一致性试验一览表·······················································································30

附录X（资料性）本文件与上一版本的结构对照情况··························································35

参考文献····················································································································38

图1缺陷：裂纹和裂缝··································································································6

图2缺陷：裂纹或裂缝··································································································6

图3缺陷：分离或分层··································································································7

图4电极暴露·············································································································7

图5电容器端头基面····································································································7

图6回流焊接曲线·····································································································12

图A.1尺寸··············································································································27

表1标称电容量的允许偏差···························································································3

表2温度系数和允许偏差（以20℃为基准温度）··································································4

表3温度系数和允许偏差的组合·····················································································4

表4损耗角正切极限值·································································································8

Ⅱ

GB/T6346.21—2026/IEC60384⁃21：2024

表5试验电压·············································································································9

表6温度循环漂移极限值····························································································10

表7Sn⁃Ag⁃Cu合金的回流焊接曲线···············································································12

表8最大电容量变化··································································································12

表9最大电容量变化··································································································14

表10交变湿热其余循环的次数·····················································································15

表11最后检查、测量和要求·························································································15

表12恒定湿热试验条件······························································································16

表13最后检查、测量和要求·························································································16

14=17

表耐久性试验条件（UCUR）····················································································

15≠17

表耐久性试验条件（UCUR）····················································································

表16最后检查、测量和要求·························································································17

表17初始测量··········································································································19

表18加速恒定湿热试验条件························································································19

表19鉴定批准试验的固定样本大小——评定水平EZ························································22

表20鉴定批准试验一览表···························································································23

表A.1尺寸··············································································································27

表B.1基准温度为25℃的温度系数及其允许偏差·····························································28

表C.1逐批检验········································································································29

表C.2周期检验········································································································30

表C.3质量一致性试验一览表（逐批检验）·······································································30

表C.4质量一致性试验一览表（周期检验）·······································································32

表X.1本文件与上一版本的结构编号对照一览表······························································35

Ⅲ

GB/T6346.21—2026/IEC60384⁃21：2024

前言

本文件按照GB/T1.1—2020《标准化工作导则第1部分：标准化文件的结构和起草规则》的规

定起草。

本文件是GB/T6346《电子设备用固定电容器》的第21部分。GB/T6346已经发布了以下部分：

——第1部分：总规范；

——第2部分：分规范金属化聚对苯二甲酸乙二醇酯膜介质直流固定电容器；

3MnO

——第部分：分规范表面安装2固体电解质钽固定电容器；

3⁃1MnOEZ

——第部分：空白详细规范表面安装2固体电解质钽固定电容器评定水平；

——第11部分：分规范金属箔式聚对苯二甲酸乙二醇酯膜介质直流固定电容器；

——第11⁃1部分：空白详细规范金属箔式聚乙烯对苯二甲酸乙二醇酯膜介质直流固定电容器

评定水平EZ；

——第13部分：分规范金属箔式聚丙烯膜介质直流固定电容器；

——第14部分：分规范抑制电源电磁干扰用固定电容器；

——第14⁃1部分：空白详细规范抑制电源电磁干扰用固定电容器评定水平DZ；

——第16部分：分规范金属化聚丙烯膜介质直流固定电容器；

——第17部分：分规范金属化聚丙烯膜介质交流和脉冲固定电容器；

——第19部分：分规范表面安装金属化聚对苯二甲酸乙二醇酯膜介质直流固定电容器；

——第20部分：分规范表面安装金属化聚苯硫醚膜介质直流固定电容器；

——第21部分：分规范表面安装用1类多层瓷介固定电容器；

——第22部分：分规范表面安装用2类多层瓷介固定电容器；

——第23部分：分规范表面安装金属化聚萘二甲酸乙二醇酯膜介质直流固定电容器；

——第23⁃1部分：空白详细规范表面安装金属化聚萘二甲酸乙二醇酯膜介质直流固定电容器

评定水平EZ；

——第24部分：分规范表面安装导电聚合物固体电解质钽固定电容器；

——第25部分：分规范表面安装导电高分子固体电解质铝固定电容器；

——第25⁃1部分：空白详细规范表面安装导电高分子固体电解质铝固定电容器评定水平EZ；

——第26部分：分规范导电高分子固体电解质铝固定电容器；

——第26⁃1部分：空白详细规范导电高分子固体电解质铝固定电容器评定水平EZ。

本文件代替GB/T21041—2007《电子设备用固定电容器第21部分：分规范表面安装用1类

多层瓷介固定电容器》，与GB/T21041—2007相比，除结构调整和编辑性改动外，主要技术变化如下：

a)增加了电容量允许的相对变化计算公式（见表3）；

b)增加了针对非常小的电容器外观检查要求（见5.5.2）；

c)增加了C0G和U2J的适用范围（见表4、表6、表8、表9、表11、表13、表16）；

d)更改了耐电压试验的试验电压条件（见表5，2007年版的表8）；

e)增加了“剪切试验”（原“附着力”）的施加力的规定（见5.8）；

f)增加了“基板弯曲试验”（原“端面镀层结合强度”）的弯曲深度、弯曲次数、弯曲工具的半径、基

板厚度规定（见5.9.1）；

g)增加了耐焊接热试验焊料、相应的回流焊接曲线及试验次数的规定（见5.10.3）；

h)增加了可焊性试验焊料及对应不同焊料的试验条件的规定（见5.11.2）；

Ⅴ

GB/T6346.21—2026/IEC60384⁃21：2024

i)增加了恒定湿热试验条件具体规定（见5.14.3）；

j)增加了0201M和0402M尺寸的规定（见附录A）；

k）增加了基准温度为25℃的C0G和U2J特性的温度系数和允许偏差的组合的规定（见附录B）；

l)增加了质量一致性检验的规定（见附录C）。

本文件等同采用IEC60384⁃21：2024《电子设备用固定电容器第21部分：分规范表面安装用1

类多层瓷介固定电容器》。

本文件做了下列最小限度的编辑性改动：

——增加了表19中脚注h（见表19）。

请注意本文件的某些内容可能涉及专利。本文件的发布机构不承担识别专利的责任。

本文件由中华人民共和国工业和信息化部提出。

本文件由全国电子设备用阻容元件标准化技术委员会（SAC/TC165）归口。

本文件起草单位：福建火炬电子科技股份有限公司、中国电子技术标准化研究院、广东微容电子科

技股份有限公司、深圳市宇阳科技发展有限公司、杭州灵通电子有限公司、广州创天电子科技股份有限

公司、北京元六鸿远电子科技股份有限公司。

本文件主要起草人：刘梦颖、林志盛、曹锦珠、向勇、杨俊、张子山、谢丽鲜、吴浩、胜鹏。

本文件及其所代替文件的历次版本发布情况为：

——2007年首次发布为GB/T21041—2007；

——本次为第一次修订，标准编号调整为GB/T6346.21—2026。

Ⅵ

GB/T6346.21—2026/IEC60384⁃21：2024

引言

GB/T6346《电子设备用固定电容器》由总规范、分规范、空白详细规范和详细规范分层体系文件

构成，旨在指导行业更加有效地解决对电子设备用固定电容器的产品质量评价问题。GB/T6346拟由

26个部分构成。

——第1部分：总规范。

——第1⁃1部分：通用空白详细规范。

——第2部分：分规范金属化聚对苯二甲酸乙二醇酯膜介质直流固定电容器。

3MnO

——第部分：分规范表面安装固体（2）电解质钽固定电容器。

4MnO

——第部分：分规范固体（2）和非固体电解质铝固定电容器。

——第5部分：分规范额定电压不超过3000伏的直流云母介质固定电容器试验方法的选择和

一般要求。

——第6部分：分规范金属化聚碳酸酯膜介质直流固定电容器。

——第7部分：分规范金属箔式聚苯乙烯膜介质直流固定电容器。

——第8部分：分规范1类瓷介固定电容器。

——第9部分：分规范2类瓷介固定电容器。

——第11部分：分规范金属箔式聚对苯二甲酸乙二醇酯膜介质直流固定电容器。

——第13部分：分规范金属箔式聚丙烯膜介质直流固定电容器。

——第14部分：分规范抑制电源电磁干扰用固定电容器。

——第14⁃1部分：空白详细规范抑制电源电磁干扰用固定电容器评定水平DZ。

——第15部分：分规范非固体或固体电解质钽固定电容器。

——第16部分：分规范金属化聚丙烯膜介质直流固定电容器。

——第17部分：分规范金属化聚丙烯膜介质交流和脉冲固定电容器。

18MnO

——第部分：分规范表面安装固体（2）和非固体电解质铝固定电容器。

——第19部分：分规范表面安装金属化聚对苯二甲酸乙二醇酯膜介质直流固定电容器。

——第20部分：分规范表面安装金属化聚苯硫醚膜介质直流固定电容器。

——第21部分：分规范表面安装用1类多层瓷介固定电容器。

——第22部分：分规范表面安装用2类多层瓷介固定电容器。

——第23部分：分规范表面安装金属化聚萘二甲酸乙二醇酯膜介质直流固定电容器。

——第24部分：分规范表面安装导电聚合物固体电解质钽固定电容器。

——第25部分：分规范表面安装导电聚合物固体电解质铝固定电容器。

——第26部分：分规范导电聚合物固体电解质铝固定电容器。

总规范。目的在于确定电子设备用固定电容器门类的大部分共同的项目，术语、检验程序和试验

方法。

分规范。分规范是总规范的下层规范，目的在于确定需要单项规定的特定的分门类或型号的固定

电容器术语和定义、优先额定值和特性，并从总规范中选择适用的质量评定程序、试验和测量方法及补

充细节，以及给出一般性能要求。这些项目通常是尺寸和特性的优先值、附加试验方法和总规范给出

的试验方法的相关规定、抽样和样品制备的要求、推荐的试验严酷等级和优先的接收判据。分规范还

确定了用于所有下层详细规范中试验一览表的结构和范围。

Ⅶ

GB/T6346.21—2026/IEC60384⁃21：2024

空白详细规范。目的在于确定不同评定水平的需要单项规定的特定的分门类或型号的固定电容

器的详细规范格式、编排和最少内容的要求，为规范编写者提供了一个符合上层的总规范或分规范要

求的详细规范的编制导则，确保统一详细规范编制的规定。

Ⅷ

GB/T6346.21—2026/IEC60384⁃21：2024

电子设备用固定电容器

第21部分：分规范

表面安装用1类多层瓷介固定电容器

1范围

本文件适用于电子设备中表面安装用无包封、具有确定的温度系数（1类介质）的多层瓷介固定电

容器，这些电容器具有金属连接片或可焊层，并主要用于印刷电路板或在混合电路上直接安装。

本文件不适用于抑制电源电磁干扰用固定电容器，这类电容器属于IEC60384⁃14的覆盖范围。

本文件的目的是对这种类型的电容器规定优先额定值和特性，并从GB/T6346.1—2024中选择适

用的质量评定程序、试验和测量方法，以及给出这种类型电容器的一般性能要求。引用本文件的详细

规范中规定的试验严酷等级和要求，具有相同或更高的性能水平，不准许降低性能水平。

2规范性引用文件

下列文件中的内容通过文中的规范性引用而构成本文件必不可少的条款。其中，注日期的引用文

件，仅该日期对应的版本适用于本文件；不注日期的引用文件，其最新版本（包括所有的修改单）适用于

本文件。

GB/T2421—2020环境试验概述和指南（IEC60068⁃1：2013，IDT）

GB/T6346.1—2024电子设备用固定电容器第1部分：总规范（IEC60384⁃1：2021，IDT）

GB/T33772.2—2025质量评定体系第2部分：电子元器件及封装件检验用抽样方案的选择

和使用（IEC61193⁃2：2007，MOD）

注：GB/T33772.2—2025被引用的内容与IEC61193⁃2：2007被引用的内容没有技术上的差异。

ISO3优先数和优先数系（Preferrednumbers—Seriesofpreferrednumbers）

注：GB/T321—2005优先数和优先数系（ISO3：1973，IDT）

IEC60068⁃2⁃58环境试验第2⁃58部分：试验试验Td：表面安装元器件（SMD）可焊性、金属

化层耐熔蚀性和耐焊接热的试验方法[Environmentaltesting—Part2⁃58：Tests—TestTd：Testmethods

forsolderability，resistancetodissolutionofmetallizationandtosolderingheatofsurfacemountingdevices

（SMD）]

3术语和定义

GB/T6346.1—2024界定的以及下列术语和定义适用于本文件。

ISO和IEC维护的用于标准化的术语数据库网址如下：

——ISO在线浏览平台：http：///obp；

——IEC电工百科：http：///。

3.1

表面安装多层电容器surfacemountmultilayercapacitor

尺寸和引出端特性及形状适合于混合电路或印刷线路板上表面安装的小型多层瓷介固定电容器。

1