GB/T 6346.22-2026 电子设备用固定电容器 第22部分:分规范 表面安装用2类多层瓷介固定电容器

GB/T 6346.22-2026 Fixed capacitors for use in electronic equipment—Part 22:Sectional specification—Fixed surface mount multilayer capacitors of ceramic dielectric,Class 2

国家标准 中文简体 即将实施 页数:56页 | 格式:PDF

基本信息

标准号
GB/T 6346.22-2026
标准类型
国家标准
标准状态
即将实施
中国标准分类号(CCS)
国际标准分类号(ICS)
发布日期
2026-09-28
实施日期
2027-04-01
发布单位/组织
国家市场监督管理总局、国家标准化管理委员会
归口单位
全国电子设备用阻容元件标准化技术委员会(SAC/TC 165)
适用范围
本文件适用于电子设备中表面安装用无包封2类多层瓷介固定电容器,这些电容器具有金属连接片或可焊层,并主要用于印刷电路板或在混合电路上直接安装。
本文件不适用于抑制电源电磁干扰用固定电容器,这类电容器属于IEC 60384-14覆盖范围。
本文件的目的是对这种类型的电容器规定优先额定值和特性,并从GB/T 6346.1-2024中选择适用的质量评定程序、试验和测量方法,以及给出这种类型电容器的一般性能要求。引用本文件的详细规范中规定的试验严酷等级和要求,具有相同或更高的性能水平,不能降低性能水平。

文前页预览

研制信息

起草单位:
福建火炬电子科技股份有限公司、中国电子技术标准化研究院、广东微容电子科技股份有限公司、深圳市宇阳科技发展有限公司、广州创天电子科技股份有限公司、潮州三环(集团)股份有限公司、杭州灵通电子有限公司、北京元六鸿远电子科技股份有限公司
起草人:
林志盛、刘梦颖、曹锦珠、向勇、杨俊、张子山、彭高东、马艳红、谢丽鲜、裴钰
出版信息:
页数:56页 | 字数:88 千字 | 开本: 大16开

内容描述

ICS31.060.10

CCSL11

中华人民共和国国家标准

GB/T6346.22—2026/IEC60384⁃22:2024

代替GB/T21042—2007

电子设备用固定电容器

第22部分:分规范

表面安装用2类多层瓷介固定电容器

Fixedcapacitorsforuseinelectronicequipment—

Part22:Sectionalspecification—

Fixedsurfacemountmultilayercapacitorsofceramicdielectric,Class2

(IEC60384⁃22:2024,IDT)

2026⁃09⁃28发布2027⁃04⁃01实施

国家市场监督管理总局

国家标准化管理委员会发布

GB/T6346.22—2026/IEC60384⁃22:2024

目次

前言··························································································································Ⅴ

引言··························································································································Ⅶ

1范围·······················································································································1

2规范性引用文件········································································································1

3术语和定义··············································································································1

4优先额定值和特性·····································································································2

4.1优先特性···········································································································2

4.2优先额定值········································································································2

5试验和测量程序········································································································4

5.1通则·················································································································4

5.2预处理··············································································································4

5.3测量条件···········································································································4

5.4安装·················································································································5

5.5外观和尺寸检查··································································································5

5.6电气试验···········································································································6

5.7电容量温度特性(基准温度20℃)············································································9

5.8剪切试验··········································································································10

5.9基板弯曲试验····································································································10

5.10耐焊接热········································································································11

5.11可焊性···········································································································13

5.12温度快速变化··································································································13

5.13气候顺序········································································································14

5.14恒定湿热········································································································16

5.15耐久性···········································································································17

5.16引出端强度(仅对带式引出端)·············································································19

5.17元件耐溶剂性(要求时)······················································································19

5.18标志耐溶剂(要求时)·························································································19

5.19加速恒定湿热(要求时)······················································································19

6标志·····················································································································20

6.1通则················································································································20

6.2标志内容··········································································································20

6.3电容器本体标志·································································································21

6.4标志要求··········································································································21

Ⅰ

GB/T6346.22—2026/IEC60384⁃22:2024

6.5包装标志··········································································································21

6.6附加标志··········································································································21

7详细规范中应规定的内容··························································································21

7.1通则················································································································21

7.2外形图和尺寸····································································································21

7.3安装················································································································21

7.4额定值和特性····································································································21

7.5标志················································································································22

8质量评定程序·········································································································22

8.1制造初始阶段····································································································22

8.2结构相似元件····································································································22

8.3放行批合格证明记录···························································································22

8.4鉴定批准··········································································································22

附录A(规范性)表面安装用2类多层瓷介固定电容器尺寸代码规范导则·······························28

附录B(规范性)2类瓷介固定电容器电容量的老化···························································29

B.1通则···············································································································29

B.2电容量老化规律································································································29

B.3电容量的测量和电容量允许偏差···········································································29

B.4专门预处理(见5.2)····························································································30

附录C(规范性)电容量温度特性(以25℃为基准温度)······················································31

附录D(规范性)质量一致性检验··················································································33

D.1检验批的构成···································································································33

D.2试验一览表······································································································33

D.3延期交货·········································································································33

D.4评定水平·········································································································33

D.5质量一致性试验一览表·······················································································34

附录X(资料性)本文件与上一版本的结构对照情况··························································39

参考文献····················································································································42

图1缺陷:裂纹和裂缝··································································································5

图2缺陷:裂纹或裂缝··································································································5

图3缺陷:分离或分层··································································································5

图4电极暴露·············································································································6

图5电容器端头基面····································································································6

图6回流焊接曲线·····································································································12

图A.1尺寸··············································································································28

Ⅱ

GB/T6346.22—2026/IEC60384⁃22:2024

表1类别电压的优先值·································································································3

表2标称电容量的允许偏差···························································································3

表3电容量温度特性····································································································4

表4测量条件·············································································································6

表5损耗角正切极限值·································································································7

表6试验电压·············································································································9

表7测量条件···········································································································10

表8Sn⁃Ag⁃Cu合金的回流焊接曲线···············································································12

表9最大电容量变化··································································································12

表10最大电容量变化·································································································14

表11交变湿热的其余循环次数·····················································································15

表12最后检查、测量和要求·························································································15

表13恒定湿热试验条件······························································································16

表14最后检查、测量和要求·························································································17

15=18

表耐久性试验条件(UCUR)····················································································

16≠18

表耐久性试验条件(UcUR)····················································································

表17最后检查、测量和要求·························································································18

表18初始测量··········································································································20

表19加速恒定湿热试验条件························································································20

表20鉴定批准试验的固定样本大小——评定水平EZ························································23

表21鉴定批准试验一览表···························································································24

表A.1尺寸··············································································································28

表C.1基准温度为25℃的电容量温度特性······································································31

表C.2施加和不施加直流电压时的电容量温度特性优先值··················································32

表C.3基准温度为25℃的电容量温度特性的测量条件·······················································32

表D.1逐批检验········································································································33

表D.2周期检验········································································································34

表D.3质量一致性试验一览表(逐批检验)·······································································34

表D.4质量一致性试验一览表(周期检验)·······································································36

表X.1本文件与上一版本的结构对照情况·······································································39

Ⅲ

GB/T6346.22—2026/IEC60384⁃22:2024

前言

本文件按照GB/T1.1—2020《标准化工作导则第1部分:标准化文件的结构和起草规则》的规定

起草。

本文件是GB/T6346《电子设备用固定电容器》的第22部分。GB/T6346已经发布了如下部分:

——第1部分:总规范;

——第2部分:分规范金属化聚对苯二甲酸乙二醇酯膜介质直流固定电容器;

3MnO

——第部分:分规范表面安装2固体电解质钽固定电容器;

3⁃1MnOEZ

——第部分:空白详细规范表面安装2固体电解质钽固定电容器评定水平;

——第11部分:分规范金属箔式聚对苯二甲酸乙二醇酯膜介质直流固定电容器;

——第11⁃1部分:空白详细规范金属箔式聚乙烯对苯二甲酸乙二醇酯膜介质直流固定电容器

评定水平EZ;

——第13部分:分规范金属箔式聚丙烯膜介质直流固定电容器;

——第14部分:分规范抑制电源电磁干扰用固定电容器;

——第14⁃1部分:空白详细规范抑制电源电磁干扰用固定电容器评定水平DZ;

——第16部分:分规范金属化聚丙烯膜介质直流固定电容器;

——第17部分:分规范金属化聚丙烯膜介质交流和脉冲固定电容器;

——第19部分:分规范表面安装金属化聚对苯二甲酸乙二醇酯膜介质直流固定电容器;

——第20部分:分规范表面安装金属化聚苯硫醚膜介质直流固定电容器;

——第21部分:分规范表面安装用1类多层瓷介固定电容器;

——第22部分:分规范表面安装用2类多层瓷介固定电容器;

——第23部分:分规范表面安装金属化聚萘二甲酸乙二醇酯膜介质直流固定电容器;

——第23⁃1部分:空白详细规范表面安装金属化聚萘二甲酸乙二醇酯膜介质直流固定电容器

评定水平EZ;

——第24部分:分规范表面安装导电聚合物固体电解质钽固定电容器;

——第25部分:分规范表面安装导电高分子固体电解质铝固定电容器;

——第25⁃1部分:空白详细规范表面安装导电高分子固体电解质铝固定电容器评定水平EZ;

——第26部分:分规范导电高分子固体电解质铝固定电容器;

——第26⁃1部分:空白详细规范导电高分子固体电解质铝固定电容器评定水平EZ。

本文件代替GB/T21042—2007《电子设备用固定电容器第22部分:分规范表面安装用2类

多层瓷介固定电容器》,与GB/T21042—2007相比,除结构调整和编辑性改动外,主要技术变化如下:

a)删除了优先值的规定(见2007年版的表3);

b)增加了针对非常小的电容器外观检查要求(见5.5.2);

c)增加了电容量仲裁测量的要求(见)

d)增加了基准温度为25℃时的要求值(见表5、表9、表10、表12、表14、表17);

e)更改了耐电压试验的试验电压条件(见表6,2007年版的表9);

f)增加了“剪切试验”(原“附着力”)的施加力的规定(见5.8);

g)增加了“基板弯曲试验”(原“端面镀层结合强度”)的弯曲深度、弯曲次数、弯曲工具的半径、基

板厚度的规定(见5.9.1);

h)增加了耐焊接热试验焊料、相应的回流焊接曲线及试验次数的规定(见5.10.4);

Ⅴ

GB/T6346.22—2026/IEC60384⁃22:2024

i)增加了可焊性试验焊料及对应不同焊料的试验条件的规定(见5.11.2);

j)增加了恒定湿热试验条件具体规定(见5.14.4);

k)增加了0201M和0402M尺寸的规定(见附录A);

l)更改附录“2类瓷介固定电容器电容量的老化”为规范性附录(见附录B,2007年版的附录B);

m)增加了基准温度为25℃的电容量温度特性(见附录C);

n)增加了质量一致性检验的规定(见附录D)。

本文件等同采用IEC60384⁃22:2024《电子设备用固定电容器第22部分:分规范表面安装用

2类多层瓷介固定电容器》。

本文件做了下列最小限度的编辑性改动:

——增加了表20中脚注h(见表20)。

请注意本文件的某些内容可能涉及专利。本文件的发布机构不承担识别专利的责任。

本文件由中华人民共和国工业和信息化部提出。

本文件由全国电子设备用阻容元件标准化技术委员会(SAC/TC165)归口。

本文件起草单位:福建火炬电子科技股份有限公司、中国电子技术标准化研究院、广东微容电子科

技股份有限公司、深圳市宇阳科技发展有限公司、广州创天电子科技股份有限公司、潮州三环(集团)股

份有限公司、杭州灵通电子有限公司、北京元六鸿远电子科技股份有限公司。

本文件主要起草人:林志盛、刘梦颖、曹锦珠、向勇、杨俊、张子山、彭高东、马艳红、谢丽鲜、裴钰。

本文件及其所代替文件的历次版本发布情况为:

——2007年首次发布为GB/T21042—2007;

——本次为第一次修订,标准编号调整为GB/T6346.22—2026。

Ⅵ

GB/T6346.22—2026/IEC60384⁃22:2024

引言

GB/T6346《电子设备用固定电容器》由总规范、分规范、空白详细规范和详细规范分层体系文件

构成,旨在指导行业更加有效地解决对电子设备用固定电容器的产品质量评价问题。GB/T6346拟由

26个部分构成。

——第1部分:总规范。

——第1⁃1部分:通用空白详细规范。

——第2部分:分规范金属化聚对苯二甲酸乙二醇酯膜介质直流固定电容器。

3MnO

——第部分:分规范表面安装固体(2)电解质钽固定电容器。

4MnO

——第部分:分规范固体(2)和非固体电解质铝固定电容器。

——第5部分:分规范额定电压不超过3000伏的直流云母介质固定电容器试验方法的选择和

一般要求。

——第6部分:分规范金属化聚碳酸酯膜介质直流固定电容器。

——第7部分:分规范金属箔式聚苯乙烯膜介质直流固定电容器。

——第8部分:分规范1类瓷介固定电容器。

——第9部分:分规范2类瓷介固定电容器。

——第11部分:分规范金属箔式聚对苯二甲酸乙二醇酯膜介质直流固定电容器。

——第13部分:分规范金属箔式聚丙烯膜介质直流固定电容器。

——第14部分:分规范抑制电源电磁干扰用固定电容器。

——第14⁃1部分:空白详细规范抑制电源电磁干扰用固定电容器评定水平DZ。

——第15部分:分规范非固体或固体电解质钽固定电容器。

——第16部分:分规范金属化聚丙烯膜介质直流固定电容器。

——第17部分:分规范金属化聚丙烯膜介质交流和脉冲固定电容器。

18MnO

——第部分:分规范表面安装固体(2)和非固体电解质铝固定电容器。

——第19部分:分规范表面安装金属化聚对苯二甲酸乙二醇酯膜介质直流固定电容器。

——第20部分:分规范表面安装金属化聚苯硫醚膜介质直流固定电容器。

——第21部分:分规范表面安装用1类多层瓷介固定电容器。

——第22部分:分规范表面安装用2类多层瓷介固定电容器。

——第23部分:分规范表面安装金属化聚萘二甲酸乙二醇酯膜介质直流固定电容器。

——第24部分:分规范表面安装导电聚合物固体电解质钽固定电容器。

——第25部分:分规范表面安装导电聚合物固体电解质铝固定电容器。

——第26部分:分规范导电聚合物固体电解质铝固定电容器。

总规范。目的在于确定电子设备用固定电容器门类的大部分共同的项目,术语、检验程序和试验

方法。

分规范。分规范是总规范的下层规范。目的在于确定需要单项规定的特定的分门类或型号的固

定电容器术语和定义、优先额定值和特性,并从总规范中选择适用的质量评定程序、试验和测量方法及

补充细节,以及给出一般性能要求。这些项目通常是尺寸和特性的优先值、附加试验方法和总规范给

出的试验方法的相关规定、抽样和样品制备的要求、推荐的试验严酷等级和优先的接收判据。分规范

还确定了用于所有下层详细规范中试验一览表的结构和范围。

Ⅶ

GB/T6346.22—2026/IEC60384⁃22:2024

空白详细规范。目的在于确定不同评定水平的需要单项规定的特定的分门类或型号的固定电容

器的详细规范格式、编排和最少内容的要求,为规范编写者提供了一个符合上层的总规范或分规范要

求的详细规范的编制导则,确保统一详细规范编制的规定。

Ⅷ

GB/T6346.22—2026/IEC60384⁃22:2024

电子设备用固定电容器

第22部分:分规范

表面安装用2类多层瓷介固定电容器

1范围

本文件适用于电子设备中表面安装用无包封2类多层瓷介固定电容器,这些电容器具有金属连接

片或可焊层,并主要用于印刷电路板或在混合电路上直接安装。

本文件不适用于抑制电源电磁干扰用固定电容器,这类电容器属于IEC60384⁃14覆盖范围。

本文件的目的是对这种类型的电容器规定优先额定值和特性,并从GB/T6346.1—2024中选择适

用的质量评定程序、试验和测量方法,以及给出这种类型电容器的一般性能要求。引用本文件的详细

规范中规定的试验严酷等级和要求,具有相同或更高的性能水平,不能降低性能水平。

2规范性引用文件

下列文件中的内容通过文中的规范性引用而构成本文件必不可少的条款。其中,注日期的引用文

件,仅该日期对应的版本适用于本文件;不注日期的引用文件,其最新版本(包括所有的修改单)适用于

本文件。

GB/T2421—2020环境试验概述和指南(IEC60068⁃1:2013,IDT)

GB/T6346.1—2024电子设备用固定电容器第1部分:总规范(IEC60384⁃1:2021,IDT)

GB/T33772.2—2025质量评定体系第2部分:电子元器件及封装件检验用抽样方案的选择

和使用(IEC61193⁃2:2007,MOD)

注:GB/T33772.2—2025被引用的内容与IEC61193⁃2:2007被引用的内容没有技术上的差异。

ISO3优先数和优先数系(Preferrednumbers—Seriesofpreferrednumbers)

注:GB/T321—2005优先数和优先数系(ISO3:1973,IDT)

IEC60068⁃2⁃58环境试验第2⁃58部分:试验试验Td:表面安装元器件(SMD)可焊性、金属

化层耐熔蚀性和耐焊接热的试验方法[Environmentaltesting—Part2⁃58:Tests—TestTd:Testmethods

forsolderability,resistancetodissolutionofmetallizationandtosolderingheatofsurfacemountingdevices

(SMD)]

3术语和定义

GB/T6346.1—2024界定的以及下列术语和定义适用于本文件。

ISO和IEC维护的用于标准化的术语数据库网址如下:

——ISO在线浏览平台:http:///obp;

——IEC电工百科:http:///。

3.1

表面安装多层电容器surfacemountmultilayercapacitor

尺寸和引出端特性及形状适合于混合电路或印刷线路板上表面安装的小型多层瓷介固定电容器。

1

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