译：JB/T 8250.2-1999 Test method for efficiency of contacts and contact duration

译：GB/T 17562.1-1998 Rectangular connectors for frequencies below 3MHz Part 1:Generic specification—General requirements and quide for the preparation of detail specifications,for connectors with assessed quality

译：GB/T 15157.2-1998 Connectors for frequencies below 3MHz for use with printed boards—Part 2:Detail specification for two—Part connectors with assessed quality, for printed boards, for basic grid of 2.54mm(0.1in) with common mounting features

译：GB/T 13419-1998 Electromechanical switches for use in electronic equipment Part 6:Sectional specification for sensitive switches

译：GB/T 13420-1998 Electromechanical switches for use in electronic equipment Part 6:Sectional specification for sensitive switches Section 1:Blank detail specification

译：GB/T 17209-1998 Electromechanical switches for use in electronic equipment—Part 2:Sectional specification for rotary switches

译：GB/T 17210-1998 Electromechanical switches for use in electronic equipment—Part 2:Sectional specification for rotary switches Section 1-Blank detail specification

译：GB/T 5095.5-1997 Electromechanical components for electronic equipment Basic testing procedures and measuring methods—Part 5:Impact tests (free components),static load tests(fixed components),endurance tests and overload tests

译：GB/T 5095.8-1997 Electromechanical components for electronic equipment Basic testing procedures and measuring methods—Part 8:Connector tests(mechanical) and mechanical tests on contacts and terminations

译：GB/T 5095.3-1997 Electromechanical components for electronic equipment Basic testing procedures and measuring methods —Part 3:Current-carrying capacity tests

译：GB/T 5095.2-1997 Electromechanical components for electronic equipment Basic testing procedures and measuring methods—Part 2:General examination, electrical continuity and contact resistance tests, insulation tests and voltage stress tests

译：GB/T 5095.9-1997 Electromechanical components for electronic equipment Basic testing procedures and measuring methods—Part 9:Miscellaneous tests

译：GB/T 5095.11-1997 Electromechanical components for electronic equipment Basic testing procedures and measuring methods—Part 11:Climatic tests

译：GB/T 5095.15-1997 Electromechanical components for electronic equipment Basic testing procedures and measuring methods—Part 15:Mechanical tests on contacts and terminations Section 8:Test 15h—Contact retention system resistance to tool application

译：GB/T 5095.12-1997 Electromechanical components for electronic equipment—Basic testing procedures and measuring methods—Part 12:Soldering tests Section 6:Test 12f—Sealing against flux and cleaning solvents in machine soldering

译：GB/T 5095.4-1997 Electromechanical components for electronic equipment Basic testing procedures and measuring methods—Part 4:Dynamic stress tests

译：GB/T 5095.7-1997 Electromechanical components for electronic equipment Basic testing procedures and measuring methods—Part 7:Mechanical operating tests and sealing tests

译：GB/T 5095.6-1997 Electromechanical components for electronic equipment Basic testing procedures and measuring methods—Part 6:Climatic tests and soldering tests

译：GB/T 5095.1-1997 Electromechanical components for electronic equipment Basic testing procedures and measuring methods—Part 1:General

译：GB/T 11313-1996 Redio-frequency connectors—Part 1:Generic specification—General requirements and measuring methods