译：GB/T 17574.11-2006 Semiconductor devices—Integrated circuits—Part 2-11:Digital integrated circuits—Blank detail specification for single supply integrated circuit electrically erasable and programmable read-only memory

译：GB/T 17574.9-2006 Semiconductor devices—Integrated circuits—Part 2-9:Digital integrated circuits—Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories

译：GB/T 17574.20-2006 Semiconductor devices—Integrated circuits—Part 2-20:Digital integrated circuits—Family specification—Low voltage integrated circuits

译：GB/T 20515-2006 Semiconductor devices—Integrated circuits—Part 5:Semicustom integrated circuits

译：GB/T 12750-2006 Semiconductor devices—Integrated circuits—Part 11:Sectional specification for semiconductor integrated circuits excluding hybrid circuits

译：GB/T 20296-2006 Mnemonics and symbols for integrated circuits

译：GB/T 17574.10-2003 Semiconductor devices-Integrated circuits—Part 2-10:Digital integrated circuits-Blank detail specification for integrated circuit dynamic read/write memories

译：GB/T 19403.1-2003 Semiconductor devices—Integrated Circuits—Part11:Section1:Internal visual examination for semiconductor integrated circuits(excluding hybrid circuits)

译：GB/T 19248-2003 Test method for measuring the resistance of package leads

译：GB/T 18500.1-2001 Semiconductor devices—Integrated circuits Part 4:Interface integrated circuits Section 1:Blank detail specification for linear digital-to-analogue converters(DAC)

译：GB/T 18500.2-2001 Semiconductor devices—Integrated circuits—Part 4:Interface integrated circuits—Section 2:Blank detail specification for linear analogue-to-digital converters(ADC)

译：GB/T 5965-2000 Semiconductor devices—Integrated circuits—Part 2:Digital integrated circuits—Section one—Blank detail specification for bipolar monolithic digital integrated circuit gates(excluding uncommitted logic arrays)

译：GB/T 17940-2000 Semiconductor devices—Integrated circuits—Part 3:Analogue integrated circuits

译：GB/T 17864-1999 CD Metrology procedures

译：GB/T 17865-1999 Specification for measuring depth of focus and best focus

译：GB/T 17866-1999 Guideline for programmed defect masks and benchmark procedures for sensitivity analysis of mask defect inspection systems

译：GB/T 17572-1998 Semiconductor devices—Integrated circuits Part 2:Digital integrated circuits Section four—Family specification for complementary MOS digital integrated circuits,scries 4000B and 4000UB

译：GB/T 9424-1998 Semiconductor devices lntegrated circuits Part 2:Digital integrated circuits Section five-Blank detail specification for complementary MOS digital integrated circuits,series 4000B and 4000UB

译：GB/T 17574-1998 Semiconductor devices Integrated circuits Part 2:Digital integrated circuits

译：GB/T 17024-1997 Semiconductor devices integrated circuits—Part2:Digital Integrated circuits Section three—Blank detail specification for HCMOS digital integrated circuits series 54/74HC,54/74HCT,54/74HCU