GB/T 48178-2026 集成电路电子设计自动化工具测试方法

ICS31.200

CCSL55

中华人民共和国国家标准

GB/T48178—2026

集成电路电子设计自动化工具测试方法

Testingmethodforintegratedcircuitelectronicdesignautomationtools

2026⁃08⁃28发布2027⁃03⁃01实施

国家市场监督管理总局

国家标准化管理委员会发布

GB/T48178—2026

目次

前言··························································································································Ⅲ

1范围·······················································································································1

2规范性引用文件········································································································1

3术语和定义··············································································································1

4缩略语····················································································································1

5测试要求·················································································································4

5.1通用性测试要求··································································································4

5.2工艺模型···········································································································5

5.3模拟电路和光电电路····························································································6

5.4数字逻辑设计与验证···························································································11

5.5物理实现··········································································································15

5.6晶圆制造··········································································································22

5.7封装················································································································25

6测试方法···············································································································26

6.1测试流程··········································································································26

6.2测试框架··········································································································26

6.3测试关键要素····································································································27

参考文献····················································································································29

Ⅰ

GB/T48178—2026

前言

本文件按照GB/T1.1—2020《标准化工作导则第1部分：标准化文件的结构和起草规则》的规定

起草。

请注意本文件的某些内容可能涉及专利。本文件的发布机构不承担识别专利的责任。

本文件由中华人民共和国工业和信息化部提出。

本文件由全国集成电路标准化技术委员会（SAC/TC599）归口。

本文件起草单位：中国电子技术标准化研究院、北京科技大学、上海电子设计自动化发展促进会、

深圳市海思半导体有限公司、华芯巨数（杭州）微电子有限公司、上海概伦电子股份有限公司、上海立芯

软件科技有限公司、芯华章科技股份有限公司、宁波大学、上海合见工业软件集团股份有限公司、杭州

芯晓电子科技有限公司、上海合昕工业软件有限公司、深圳日观芯设自动化有限公司、上海启芯领航半

导体有限公司、芯和半导体（上海）股份有限公司、上海思尔芯技术股份有限公司、上海逍遥光电科技有

限公司、全芯智造技术股份有限公司、杭州广立微电子股份有限公司、东方晶源微电子科技（北京）股份

有限公司、北京华大九天科技股份有限公司、浙江大学滨江研究院、奇捷科技（深圳）有限公司、青岛展

诚科技有限公司、国能数智科技开发（北京）有限公司、杭州行芯科技有限公司、北京航空航天大学、

北京汤谷软件技术有限公司。

本文件主要起草人：郭楠、刘舒宁、姚海龙、郑云升、张旻、董哲、黄铮、钟乐、王金铭、乔薛鹏、陈鹤、

储著飞、孙晓阳、谢卓、冯晓龙、林逸舟、高绪禹、王磊、蒙玉宝、沈文正、陈昇祐、孟晓东、朱亮、赵永林、

潘钧儒、施伟杰、邹兰榕、陈弼梅、魏星、孙延辉、张凯、赵小磊、成元庆、刘丹。

Ⅲ

GB/T48178—2026

集成电路电子设计自动化工具测试方法

1范围

本文件规定了集成电路电子设计自动化工具通用、工艺模型、模拟电路和光电电路、数字逻辑设计

与验证、物理实现、晶圆制造和封装的测试要求，描述了相应的测试方法。

本文件适用于集成电路电子设计自动化工具的测试。

2规范性引用文件

下列文件中的内容通过文中的规范性引用而构成本文件必不可少的条款。其中，注日期的引用文

件，仅该日期对应的版本适用于本文件；不注日期的引用文件，其最新版本（包括所有的修改单）适用于

本文件。

GB/T48179—2026集成电路电子设计自动化工具术语

3术语和定义

GB/T48179—2026界定的以及下列术语和定义适用于本文件。

3.1

测试设计testdesign

为了满足需求的完整性和正确性而进行的包括测试流程制定、测试需求分析和测试用例设计在内

的一系列活动。

3.2

测试用例集testsuite

对特定软件产品进行测试方案、测试方法、测试技术和测试策略描述的数据集。

4缩略语

下列缩略语适用于本文件。

AC：交流（AlternatingCurrent）

ADC：模数转换器（Analog⁃to⁃DigitalConverter）

AMS：模拟/混合信号（Analog/Mixed⁃Signal）

APR：自动布局布线（AutomaticPlacementandRouting）

ARM：高级精简指令集机器（AdvancedRISCMachine）

ATDF：自动化测试数据格式（AutomatedTestDataFormat）

ATE：自动测试设备（AutomaticTestEquipment）

ATPG：自动测试向量生成（AutomaticTestPatternGeneration）

BJT：双极性结型晶体管（BipolarJunctionTransistor）

BSIM：伯克利短沟道绝缘栅场效应晶体管模型（BerkeleyShort⁃channelInsulatedGateField⁃Effect

TransistorModel）

1