译：GB/T 5965-2000 Semiconductor devices—Integrated circuits—Part 2:Digital integrated circuits—Section one—Blank detail specification for bipolar monolithic digital integrated circuit gates(excluding uncommitted logic arrays)

译：GB/T 17940-2000 Semiconductor devices—Integrated circuits—Part 3:Analogue integrated circuits

译：GB/T 17865-1999 Specification for measuring depth of focus and best focus

译：GB/T 17864-1999 CD Metrology procedures

译：GB/T 17866-1999 Guideline for programmed defect masks and benchmark procedures for sensitivity analysis of mask defect inspection systems

译：GB/T 17572-1998 Semiconductor devices—Integrated circuits Part 2:Digital integrated circuits Section four—Family specification for complementary MOS digital integrated circuits,scries 4000B and 4000UB

译：GB/T 9424-1998 Semiconductor devices lntegrated circuits Part 2:Digital integrated circuits Section five-Blank detail specification for complementary MOS digital integrated circuits,series 4000B and 4000UB

译：GB/T 17574-1998 Semiconductor devices Integrated circuits Part 2:Digital integrated circuits

译：GB/T 17024-1997 Semiconductor devices integrated circuits—Part2:Digital Integrated circuits Section three—Blank detail specification for HCMOS digital integrated circuits series 54/74HC,54/74HCT,54/74HCU

译：GB/T 17023-1997 Semiconductor devices integrated circuits—Part 2:Digital Integrated circuits Section two—Family specification for HCMOS digital integrated circuits,series 54/74HC,54/74HCT,54/74HCU

译：GB/T 16878-1997 Specification for metrology pattern cells for integrated circuit manufacture

译：GB/T 16523-1996 Specification for round quartz photomask substrates

译：GB/T 16526-1996 Test method measuring the lead-to-lead and loading capacitance of package leads

译：GB/T 16524-1996 Specification for registration marks for photomasks

译：GB/T 16527-1996 Specification for photoresist/E-beam resist for hard surface photoplates

译：GB/T 16525-1996 Specification of leadframes for plastic leaded chip carrier packages

译：GB/T 16465-1996 Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures

译：GB/T 16466-1996 Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures

译：GB/T 6798-1996 Semiconductor integrated circuits—General principles of measuring methods of voltage comparators

译：GB/T 16464-1996 Semiconductor devices Integrated circuits—Part 1:General